METHODS FOR FORMING ANTI-REFLECTION STRUCTURES FOR CMOS IMAGE SENSORS
First Claim
1. A method of forming a semiconductor structure comprising:
- forming a photodiode in a semiconductor layer;
forming a transistor on said semiconductor layer, wherein a source of said transistor is of integral construction with said photodiode;
forming an interconnect level dielectric layer embedding a metal line on said semiconductor layer; and
forming a protuberance-containing dielectric portion directly on said interconnect level dielectric layer, wherein said protuberance-containing dielectric portion comprises an array of an array of protuberances.
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Accused Products
Abstract
Protuberances, having vertical and lateral dimensions less than the wavelength range of lights detectable by a photodiode, are formed at an optical interface between two layers having different refractive indices. The protuberances may be formed by employing self-assembling block copolymers that form an array of sublithographic features of a first polymeric block component within a matrix of a second polymeric block component. The pattern of the polymeric block component is transferred into a first optical layer to form an array of nanoscale protuberances. Alternately, conventional lithography may be employed to form protuberances having dimensions less than the wavelength of light. A second optical layer is formed directly on the protuberances of the first optical layer. The interface between the first and second optical layers has a graded refractive index, and provides high transmission of light with little reflection.
53 Citations
28 Claims
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1. A method of forming a semiconductor structure comprising:
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forming a photodiode in a semiconductor layer; forming a transistor on said semiconductor layer, wherein a source of said transistor is of integral construction with said photodiode; forming an interconnect level dielectric layer embedding a metal line on said semiconductor layer; and forming a protuberance-containing dielectric portion directly on said interconnect level dielectric layer, wherein said protuberance-containing dielectric portion comprises an array of an array of protuberances. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming a semiconductor structure comprising:
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forming a photodiode in a semiconductor layer; forming a transistor on said semiconductor layer, wherein a source of said transistor is of integral construction with said photodiode; and forming a dielectric layer over said photodiode, wherein said dielectric layer laterally surrounds and overlies a gate electrode of said transistor and comprises a protuberance-containing dielectric portion which overlies said photodiode and includes an array of protuberances. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of forming a semiconductor structure comprising:
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forming a photodiode in a semiconductor layer; forming a dielectric material layer containing a lens over said photodiode in an optical path of said photodiode; and forming a protuberance-containing dielectric portion directly on said dielectric material layer, wherein said protuberance-containing dielectric portion comprises an array of protuberances. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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22. A method of forming a semiconductor structure comprising:
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forming a semiconductor chip; and encapsulating said semiconductor chip with a package housing, wherein said package housing includes an optically transparent window, said window comprising a first array of protuberances on a front surface and a second set of protuberances on a back surface. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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Specification