Apparatus with a Multi-Layer Coating and Method of Forming the Same
First Claim
1. A printed circuit board, comprising:
- a substrate comprising an insulating material;
a plurality of conductive tracks attached to at least one surface of the substrate;
a multi-layer coating deposited on the at least one surface of the substrate, the multi-layer coating covering at least a portion of the plurality of conductive tracks, the multi-layer coating comprising at least one layer formed of a halo-hydrocarbon polymer; and
at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
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Accused Products
Abstract
In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
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Citations
108 Claims
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1. A printed circuit board, comprising:
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a substrate comprising an insulating material; a plurality of conductive tracks attached to at least one surface of the substrate; a multi-layer coating deposited on the at least one surface of the substrate, the multi-layer coating covering at least a portion of the plurality of conductive tracks, the multi-layer coating comprising at least one layer formed of a halo-hydrocarbon polymer; and at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method, comprising:
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attaching a plurality of conductive tracks to at least one surface of a substrate comprising an insulating material; depositing a multi-layer coating on the at least one surface of the substrate, the multi-layer coating covering at least a portion of the plurality of conductive tracks, at least one layer of the multi-layer coating comprising at least one halo-hydrocarbon polymer; and after depositing the multi-layer coating, soldering through the multi-layer coating to form a solder joint between an electrical component and at least one conductive track attached to the substrate, the solder joint abutting the multi-layer coating. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. A printed circuit board, comprising:
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a substrate comprising an insulating material; a plurality of conductive tracks attached to at least one surface of the substrate; a coating deposited on the at least one surface of the substrate, wherein; the coating covers at least a portion of the plurality of conductive tracks; and comprises at least one halo-hydrocarbon polymer; and at least one conductive wire that is connected by a wire bond to at least one conductive track, the wire bond formed through the coating without prior removal of the coating such that the wire bond abuts the coating. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61)
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62. A method, comprising:
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attaching a plurality of conductive tracks to at least one surface of a substrate comprising an insulating material; depositing a coating on the at least one surface of the substrate, the coating covering at least a portion of the plurality of conductive tracks, the coating comprising at least one halo-hydrocarbon polymer; and forming a wire bond between at least one conductive wire and at least one conductive track, the wire bond formed through the coating without prior removal of the coating such that the wire bond abuts the coating. - View Dependent Claims (63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77)
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78. An apparatus, comprising:
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a substrate comprising an insulating material; a first contact attached to at least one surface of the substrate; and a coating deposited on at least one surface of the first contact, the coating comprising at least one halo-hydrocarbon polymer, the first contact operable to conduct an electrical signal through the coating to a second contact without removal of the coating. - View Dependent Claims (79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92)
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93. A method, comprising:
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attaching a first contact to at least one surface of a substrate comprising an insulating material; depositing a coating on at least one surface of the first contact, the coating comprising at least one halo-hydrocarbon polymer, the first contact operable to conduct an electrical signal through the coating to a second contact without removal of the coating. - View Dependent Claims (94, 95, 96, 97, 98, 99, 100, 101, 102, 103, 104, 105, 106, 107, 108)
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Specification