TCE COMPENSATION FOR PACKAGE SUBSTRATES FOR REDUCED DIE WARPAGE ASSEMBLY

  • US 20110266693A1
  • Filed: 04/29/2010
  • Published: 11/03/2011
  • Est. Priority Date: 04/29/2010
  • Status: Active Grant
First Claim
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1. A method for assembling die packages, comprising:

  • attaching contacts on a first side of a plurality of first die to substrate pads on a top surface of a composite carrier, wherein said composite carrier comprises a package substrate including at least one embedded metal layer having its bottom surface secured to a semiconductor wafer;

    after said attaching, removing said semiconductor wafer from said package substrate;

    attaching a plurality of electrically conductive connectors to said bottom surface of said package substrate, andsawing said package substrate to form a plurality of singulated die packages.

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