METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER WITH A THERMAL VIA
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Abstract
A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the underlayer and a thermal via that extends from the base through the support layer to the underlayer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
5 Citations
95 Claims
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1-55. -55. (canceled)
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56. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, a support layer, an underlayer, a conductive layer and an adhesive, wherein the post is adjacent to the base, extends above the base in an upward direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer, the base extends below the post in a downward direction opposite the upward direction, extends laterally from the post in lateral directions orthogonal to the upward and downward directions and is sandwiched between the adhesive and the support layer, the conductive layer is mounted on and extends above the adhesive, the adhesive is sandwiched between the base and the conductive layer and is non-solidified, the support layer is sandwiched between the base and the underlayer, and the underlayer extends below the support layer;
thenflowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer; solidifying the adhesive;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer; providing a thermal via that extends from the base through the support layer to the underlayer and provides a thermally conductive path between the base and the underlayer; providing a heat spreader that includes the post, the base, the underlayer and the thermal via;
thenmounting a semiconductor device on the post, wherein the semiconductor device overlaps the post, the base, the support layer and the underlayer and the underlayer covers the post in the downward direction; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the underlayer. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70)
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71. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, a support layer and an underlayer, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the support layer is sandwiched between the base and the underlayer and the underlayer extends below the support layer; providing an adhesive, wherein an opening extends through the adhesive; providing a conductive layer, wherein an aperture extends through the conductive layer; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer; providing a cap that extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post; providing a thermal via that provides a thermally conductive path between the base and the underlayer, including providing a plated through-hole that extends from the base through the support layer to the underlayer; providing a heat spreader that includes the post, the base, the cap, the underlayer and the thermal via;
thenmounting a semiconductor device on the cap, wherein the semiconductor device overlaps the post, the base, the cap, the support layer and the underlayer and the underlayer covers the post in the downward direction; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the underlayer. - View Dependent Claims (72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85)
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86. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, a support layer and an underlayer, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the support layer is sandwiched between the base and the underlayer and is non-metallic and is solidified and the underlayer extends below the support layer; providing an adhesive, wherein an opening extends through the adhesive; providing a conductive layer, wherein an aperture extends through the conductive layer; mounting the adhesive on the base, including inserting the post into the opening, wherein the adhesive extends above the base and the post extends into the opening; mounting the conductive layer on the adhesive, including aligning the post with the aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the conductive layer towards one another, thereby moving the post upward in the aperture and applying pressure to the molten adhesive between the base and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a gap located in the aperture between the post and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the post and the base to the conductive layer;
thenproviding a conductive trace that includes a pad, a terminal and a routing line, wherein the pad, the terminal and the routing line include a selected portion of the conductive layer and the routing line provides an electrically conductive path between the pad and the terminal; providing a cap that extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post and includes a selected portion of the conductive layer; providing a thermal via that provides a thermally conductive path between the base and the underlayer and includes a selected portion of the conductive layer, including providing a plated through-hole that extends from the conductive layer through the adhesive to the base and from the base through the support layer to the underlayer; providing a heat spreader that includes the post, the base, the cap, the underlayer and the thermal via;
thenmounting a semiconductor device on the cap, wherein the semiconductor device overlaps the post, the base, the cap, the support layer and the underlayer and the underlayer covers the post in the downward direction; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base, thereby thermally connecting the semiconductor device to the thermal via and thereby thermally connecting the semiconductor device to the underlayer. - View Dependent Claims (87, 88, 89, 90, 91, 92, 93, 94, 95)
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Specification