WIRELESS IC DEVICE

• US 20110278362A1
• Filed: 05/03/2011
• Published: 11/17/2011
• Est. Priority Date: 05/14/2010
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: DOKAI, Yuya, GOTO, Ryohei, KAISHITA, Nihei, NONOGAKI, Hiroshi, YAMAGUCHI, Takahiro, IKEDA, Kazuyuki
• Granted Patent: US 8,905,316 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142

Abstract

A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body.

Claims

1. A wireless IC device comprising:

a dielectric body including an upper surface and a lower surface;

a radiator provided on a surface of the dielectric body; and

a wireless IC element coupled to a feeding portion of the radiator;

wherein

the radiator includes a flexible metal pattern; and

a plurality of concave portions are provided on at least one of the upper and lower surfaces of the dielectric body so as to increase a flexibility of the dielectric body.

2. The wireless IC device according to claim 1, wherein the radiator is disposed inside ridge portions of the dielectric body.

3. The wireless IC device according to claim 2, wherein the plurality of concave portions are arranged so as to include at least the ridge portions of the dielectric body.

4. The wireless IC device according to claim 1, wherein

the radiator extends from the upper surface to the lower surface via a side surface of the dielectric body;

and

the radiator is bonded to at least one of the upper surface or the lower surface and is not bonded to the side surface.

5. The wireless IC device according to claim 1, wherein the radiator is provided on a flexible film.

6. The wireless IC device according to claim 1, wherein the plurality of concave portions provided on at least one of the upper and lower surfaces of the dielectric body are slits.

7. The wireless IC device according to claim 6, wherein the slits are provided on the upper surface and the lower surface of the dielectric body.

8. The wireless IC device according to claim 7, wherein the slits are also provided on side surfaces of the dielectric body.

9. The wireless IC device according to claim 6, wherein a depth of the slits provided on the upper surface of the dielectric body is different from a depth of the slits provided on the lower surface of the dielectric body.

10. The wireless IC device according to claim 6, wherein positions of the slits provided on the upper surface of the dielectric body and positions of the slits provided on the lower surface of the dielectric body do not overlap one another.

11. The wireless IC device according to claim 6, wherein the slits arranged closer to the feeding portion from end portions of the dielectric body have a smaller the depth than slits arranged farther from the feeding portion.

12. The wireless IC device according to claim 1, further comprising a protection member arranged to cover the dielectric body, the radiator, and the wireless IC element.

13. The wireless IC device according to claim 1, wherein the wireless IC element is a wireless IC chip arranged to process a predetermined radio signal.

14. The wireless IC device according to claim 1, wherein the wireless IC element includes a wireless IC chip arranged to process a predetermined radio signal and a feeding circuit board including a feeding circuit having a predetermined resonance frequency.

15. A wireless IC device comprising:

a dielectric body including an upper surface and a lower surface;

a radiator provided on one of the upper and lower surfaces of the dielectric body; and

a wireless IC element coupled to a feeding portion of the radiator;

wherein

the radiator includes a flexible metal pattern;

a plurality of concave portions are provided on at least one of the upper and lower surfaces of the dielectric body so as to increase a flexibility of the dielectric body; and

the dielectric body is attached to a surface of a metal body.

16. The wireless IC device according to claim 15, further comprising:

a protection member arranged to cover the dielectric body, the radiator, and the wireless IC element.