Power Electronic Device Package

  • US 20110278706A1
  • Filed: 05/10/2011
  • Published: 11/17/2011
  • Est. Priority Date: 05/11/2010
  • Status: Abandoned Application
First Claim
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1. A power electronic device package, comprising:

  • a base member, thermally conductive for heat dissipation;

    a device layer comprising one or more power electronic devices mounted on said base member, wherein said one or more power electronic devices are selectively electrically connected to each other and to said base member to form an internal electronic circuit;

    a plurality of leads extending outwardly from said base member and electrically connected to said internal electronic circuit formed by said one or more power electronic devices on said base member; and

    an encapsulant encasing said internal electronic circuit formed by said one or more power electronic devices on said base member, a portion of said base member, and a portion of said plurality of leads;

    whereby said power electronic device package is configured as a power module with said plurality of leads and increased power handling capability.

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