Power Electronic Device Package

• US 20110278706A1
• Filed: 05/10/2011
• Published: 11/17/2011
• Est. Priority Date: 05/11/2010
• Status: Abandoned Application

• Current Assignee: iQXPRZ Power Inc.
• Original Assignee: iQXPRZ Power Inc.
• Inventors: Herras, Emmanuel Orpia
• Application Number:
  US13/104,319
• Publication Number:
  US 20110278706A1
• Time in Patent Office: Days
• US Class Current: 257/675
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49431 on the semiconductor or solid-state body
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49537 Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/206 : Length ranges

Abstract

A power electronic device package comprising a base member, a device layer, multiple leads, and an encapsulant is provided. The base member is thermally conductive for heat dissipation. The device layer comprises one or more power electronic devices mounted on the base member. The power electronic devices are selectively electrically connected to each other and to the base member to form an internal electronic circuit. The leads extend outwardly from the base member and are electrically connected to the internal electronic circuit. The encapsulant encases the internal electronic circuit, a portion of the base member, and a portion of the leads. The power electronic device package is configured as a transfer molded power module with multiple leads and increased power handling capability. In an embodiment, the base member is electrically conductive to operate as an electrical terminal. The base member may also be isolatably connected to the internal electronic circuit.

Claims

1. A power electronic device package, comprising:

a base member, thermally conductive for heat dissipation;

a device layer comprising one or more power electronic devices mounted on said base member, wherein said one or more power electronic devices are selectively electrically connected to each other and to said base member to form an internal electronic circuit;

a plurality of leads extending outwardly from said base member and electrically connected to said internal electronic circuit formed by said one or more power electronic devices on said base member; and

an encapsulant encasing said internal electronic circuit formed by said one or more power electronic devices on said base member, a portion of said base member, and a portion of said plurality of leads;

whereby said power electronic device package is configured as a power module with said plurality of leads and increased power handling capability.

2. The power electronic device package of claim 1, wherein said base member is isolatably connected to said internal electronic circuit formed by said selective electrical connection of said one or more power electronic devices to each other and to said plurality of leads.

3. The power electronic device package of claim 1, further comprising a substrate mounted on said base member for selectively isolating said one or more power electronic devices on said device layer from each other and from said base member.

4. The power electronic device package of claim 3, wherein said substrate is one of a metallized substrate and a direct copper bonded substrate.

5. The power electronic device package of claim 3, wherein said substrate is made of a material comprising one or more of aluminum nitride and aluminum oxide.

6. The power electronic device package of claim 1, wherein said one or more power electronic devices are directly mounted on one of said base member, a substrate mounted on said base member, and a combination thereof.

7. The power electronic device package of claim 1, further comprising a printed circuit board layer comprising one or more of complementary electronic devices and auxiliary electronic devices disposed in conjunction with said device layer mounted on one of said base member and a substrate mounted on said base member.

8. The power electronic device package of claim 7, wherein said printed circuit board layer is one of directly mounted on top of said device layer and mounted adjacent to said device layer.

9. The power electronic device package of claim 1, wherein an opposing surface of said base member is rearwardly exposed in said power electronic device package.

10. The power electronic device package of claim 1, further comprising one or more mounting holes for enabling direct installation to an external heat sink.

11. The power electronic device package of claim 1, wherein said base member is electrically conductive and configured to operate as an active electrical terminal for connection to said internal electronic circuit formed by said one or more power electronic devices mounted on said base member.

12. The power electronic device package of claim 1, wherein said base member comprises a mounting area that enables said mounting of said one or more power electronic devices in a plurality of configurations.

13. The power electronic device package of claim 1, wherein said mounted one or more power electronic devices are selectively connected to each other and to said base member by one of wire bonds, soldered interconnects, and a combination thereof to form said internal electronic circuit.

14. The power electronic device package of claim 1, wherein said base member is one of a copper base member, a direct copper bonded substrate, and a combination of said copper base member and said direct copper bonded substrate.

15. The power electronic device package of claim 1, wherein said plurality of leads comprises one of power leads, signal leads, and a combination thereof.

16. The power electronic device package of claim 1, wherein said plurality of leads is selectively combinable to increase current handling capacity of said plurality of leads and said power electronic device package.

17. The power electronic device package of claim 1 configured as a transfer molded power module in an expanded transistor outline package.

18. A method for creating a power electronic device package configured as a power module with a plurality of leads and increased power handling capability, comprising:

providing a base member thermally conductive for heat dissipation;

mounting a device layer comprising one or more power electronic devices on said base member, wherein said one or more power electronic devices are selectively electrically connected to each other and to said base member to form an internal electronic circuit;

electrically connecting said plurality of leads to said internal electronic circuit formed by said one or more power electronic devices on said base member, wherein said plurality of leads extend outwardly from said base member;

encasing said internal electronic circuit formed by said one or more power electronic devices on said base member, a portion of said base member, and a portion of said plurality of leads by an encapsulant; and

singulating said encased internal electronic circuit formed by said one or more power electronic devices on said base member, said portion of said base member, and said portion of said plurality of leads to create said power electronic device package.

19. The method of claim 18, further comprising isolatably connecting said base member to said internal electronic circuit formed by said selective electrical connection of said one or more power electronic devices to each other and to said plurality of leads.

20. The method of claim 18, further comprising mounting a substrate on said base member for selectively isolating said one or more power electronic devices on said device layer from each other and from said base member.

21. The method of claim 18, further comprising mounting a printed circuit board layer comprising one or more of complementary electronic devices and auxiliary electronic devices on top of said device layer or adjacent to said device layer mounted on one of said base member and a substrate mounted on said base member.

22. The method of claim 21, wherein said printed circuit board layer is connected to said device layer by one of jumper wires, soldered connecting terminal pins, wire bonded aluminum wires, wire bonded gold wires, and any combination thereof.

23. The method of claim 18, further comprising paralleling said power electronic devices on said base member that serves as a common active terminal, to achieve high current ratings.

24. The method of claim 18, wherein said one or more power electronic devices are mounted on one of said base member, a substrate mounted on said base member, and a combination thereof, via one of one or more mounting pads, a supplementary substrate, and a combination thereof.

25. The method of claim 18, wherein said base member is electrically conductive and configured to operate as an active electrical terminal for connection to said internal electronic circuit formed by said one or more power electronic devices mounted on said base member.