Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die
First Claim
1. A method of making a semiconductor device, comprising:
- providing a first temporary carrier;
mounting a prefabricated multi-die leadframe having a plurality of contact pads over the first temporary carrier;
mounting a first semiconductor die over the first temporary carrier between the contact pads of the leadframe;
mounting a second semiconductor die over the contact pads of the leadframe and over the first semiconductor die;
depositing an encapsulant over the leadframe and first and second semiconductor die;
removing the first temporary carrier;
forming a first interconnect structure over the leadframe and the first semiconductor die and a first surface of the encapsulant; and
cutting a channel through the encapsulant and leadframe to separate the contact pads of the leadframe.
6 Assignments
0 Petitions
Accused Products
Abstract
A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias.
88 Citations
25 Claims
-
1. A method of making a semiconductor device, comprising:
-
providing a first temporary carrier; mounting a prefabricated multi-die leadframe having a plurality of contact pads over the first temporary carrier; mounting a first semiconductor die over the first temporary carrier between the contact pads of the leadframe; mounting a second semiconductor die over the contact pads of the leadframe and over the first semiconductor die; depositing an encapsulant over the leadframe and first and second semiconductor die; removing the first temporary carrier; forming a first interconnect structure over the leadframe and the first semiconductor die and a first surface of the encapsulant; and cutting a channel through the encapsulant and leadframe to separate the contact pads of the leadframe. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method of making a semiconductor device, comprising:
-
providing a first carrier; mounting a multi-die leadframe having a plurality of contact pads over the first carrier; mounting a first semiconductor die over the first carrier between the contact pads of the leadframe; mounting a second semiconductor die over the contact pads of the leadframe and over the first semiconductor die; depositing an encapsulant over the leadframe and first and second semiconductor die; removing the first carrier; and forming a first interconnect structure over the leadframe and the first semiconductor die and a first surface of the encapsulant. - View Dependent Claims (9, 10, 11, 12, 13)
-
-
14. A method of making a semiconductor device, comprising:
-
providing a multi-die leadframe having a plurality of contact pads; mounting a first semiconductor die between the contact pads of the leadframe; mounting a second semiconductor die over the contact pads of the leadframe and over the first semiconductor die; depositing an encapsulant over the leadframe and first and second semiconductor die; and forming a first interconnect structure over the leadframe and the first semiconductor die and a first surface of the encapsulant. - View Dependent Claims (15, 16, 17, 18, 19, 20)
-
-
21. A semiconductor device, comprising:
-
a multi-die leadframe having a plurality of contact pads; a first semiconductor die mounted between the contact pads of the leadframe; a second semiconductor die mounted over the contact pads of the leadframe and over the first semiconductor die; an encapsulant deposited over the leadframe and first and second semiconductor die; and a first interconnect structure formed over the leadframe and the first semiconductor die and a first surface of the encapsulant. - View Dependent Claims (22, 23, 24, 25)
-
Specification