LIGHT EMITTING DEVICE MODULE

• US 20110280012A1
• Filed: 04/13/2011
• Published: 11/17/2011
• Est. Priority Date: 05/12/2010
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: LEE, Gun Kyo
• Granted Patent: US 9,285,083 B2
• Time in Patent Office: Days
• US Class Current: 362/231
• CPC Class Codes: F21K 9/27 Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
• CPC Class Codes: F21V 31/00 Gas-tight or water-tight arrangements
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 2201/0125 Shrinkable, e.g. heat-shrinkable polymer
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence

Abstract

A light emitting device module is provided comprising a light emitting device package, a printed circuit board on which the light emitting device package is arranged and a sealing member that surrounds the light emitting device package and the printed circuit board, wherein a predetermined space is formed between the light emitting device package and the printed circuit board and the sealing member.

Claims

1. A light emitting device module comprising:

a light emitting device package;

a printed circuit board on which the light emitting device package is arranged; and

a sealing member that surrounds the light emitting device package and the printed circuit board,

wherein a predetermined space is formed between the light emitting device package and the printed circuit board and the sealing member.

2. The light emitting device module of claim 1, wherein the predetermined space is filled in the air.

3. The light emitting device module of claim 1, wherein the predetermined space is formed at a corner of the light emitting device package which is adjacent to the printed circuit board.

4. The light emitting device module of claim 1, wherein the sealing member surrounds at least part of the printed circuit board.

5. The light emitting device module of claim 4, wherein the at least part of the printed circuit board includes both ends of the printed circuit board or a central portion of the printed circuit board.

6. The light emitting device module of claim 1, wherein at least two light emitting device packages are arranged on the printed circuit board in a series connection or parallel connection, and wherein

the sealing member for sealing at least two light emitting devices from a first light emitting device packages to a last light emitting device packages.

7. The light emitting device module of claim 1, wherein the sealing member is formed of a transparent material.

8. The light emitting device module of claim 1, wherein the sealing member is formed of a colored material.

9. The light emitting device module of claim 1, wherein the sealing member has a rounded portion near a corner of the light emitting device package which is adjacent to the printed circuit board, wherein the rounded portion has a curvature.

10. The light emitting device module of claim 9, wherein the sealing member includes,

a first surface contacting the light emitting device package and the printed circuit board, and

a second surface opposite to the first surface, the second surface exposed to an outside;

wherein the first surface has a first curvature and the second surface has a second curvature.

11. The light emitting device module of claim 10, wherein the first curvature is the same as the second curvature.

12. The light emitting device module of claim 1, wherein the sealing member has a length than the printed circuit board

13. The light emitting device module of claim 1, wherein the sealing member includes a film containing various colors of phosphors

14. The light emitting device module of claim 1, wherein the sealing member is contraction by the heat.

15. A lighting system comprising:

a light emitting device module, each of which includes a light emitting device package, a printed circuit board on which the light emitting device package is arranged and a sealing member that surrounds the light emitting device package and the printed circuit board; and

a power control module to supply the power to the light emitting device module,

wherein a predetermined space is formed between the light emitting device package and the printed circuit board and the sealing member.