METHOD OF FORMING A SEMICONDUCTOR DEVICE

  • US 20110287582A1
  • Filed: 05/10/2011
  • Published: 11/24/2011
  • Est. Priority Date: 05/18/2010
  • Status: Active Grant
First Claim
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1. A method of forming a semiconductor device, the method comprising:

  • filling a gap of a semiconductor chip stack with a sealing agent while carrying out a first heating process which heats the semiconductor chip stack from upper and lower portions of the semiconductor chip stack.

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