ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER WITH LOW UNSATURATION AND OPTIONAL VINYL SILANE

• US 20110290317A1
• Filed: 05/26/2011
• Published: 12/01/2011
• Est. Priority Date: 05/26/2010
• Status: Abandoned Application

• Current Assignee: Debra H. Niemann, John Naumovitz, Rajen M. Patel, Shaofu Wu
• Original Assignee: Debra H. Niemann, John Naumovitz, Rajen M. Patel, Shaofu Wu
• Inventors: Wu, Shaofu, Naumovitz, John, Patel, Rajen M., Niemann, Debra H.
• Application Number:
  US13/116,520
• Publication Number:
  US 20110290317A1
• Time in Patent Office: Days
• US Class Current: 136/256
• CPC Class Codes: B32B 17/10018 comprising only one glass sheet
• CPC Class Codes: B32B 17/1055 characterized by the resin layer, i.e. interlayer
• CPC Class Codes: C08L 2205/02 containing two or more polymers of the same C08L -group
• CPC Class Codes: C08L 23/08 Copolymers of ethene C08L23/16 takes precedence
• CPC Class Codes: C08L 2666/06 Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
• CPC Class Codes: H01L 31/0481 characterised by the composition of the encapsulation material
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

An electronic device module comprising:

• A. At least one electronic device, e.g., a solar cell, and
• B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene-based polymer composition characterized by a Comonomer Distribution Constant greater than about 45, more preferably greater than 50, most preferably greater than 95, and as high as 400, preferably as high as 200, wherein the composition has less than 120 total unsaturation unit/1,000,000C, preferably the ethylene-based polymer compositions comprise up to about 3 long chain branches/1000 carbons, more preferably from about 0.01 to about 3 long chain branches/1000 carbons; the ethylene-based polymer composition can have a ZSVR of at least 2; the ethylene-based polymer compositions can be further characterized by comprising less than 20 vinylidene unsaturation unit/1,000,000C; the ethylene-based polymer compositions can have a bimodal molecular weight distribution (MWD) or a multi-modal MWD; the ethylene-based polymer compositions can have a comonomer distribution profile comprising a mono or bimodal distribution from 35° C. to 120° C., excluding purge; the ethylene-based polymer compositions can comprise a single DSC melting peak; the ethylene-based polymer compositions can comprise a weight average molecular weight (Mw) from about 17,000 to about 220,000, (2) optionally, a vinyl silane, (3) optionally, a free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (4) optionally, a co-agent.

Claims

1. An electronic device module comprising:

A. at least one electronic device, and

B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene-based polymer composition characterized by a Comonomer Distribution Constant greater than about 45, more preferably greater than 50, most preferably greater than 95, and as high as 400, preferably as high as 200, wherein the composition has less than 120 total unsaturation unit/1,000,000C, preferably the ethylene-based polymer compositions comprise up to about 3 long chain branches/1000 carbons, more preferably from about 0.01 to about 3 long chain branches/1000 carbons;

the ethylene-based polymer composition can have a ZSVR of at least 2;

the ethylene-based polymer compositions can be further characterized by comprising less than 20 vinylidene unsaturation unit/1,000,000C;

the ethylene-based polymer compositions can have a bimodal molecular weight distribution (MWD) or a multi-modal MWD;

the ethylene-based polymer compositions can have a comonomer distribution profile comprising a mono or bimodal distribution from 35°

C. to 120°

C., excluding purge;

the ethylene-based polymer compositions can comprise a weight average molecular weight (Mw) from about 17,000 to about 220,000, (2) optionally, a vinyl silane in an amount of at least about 0.1 wt % based on the weight of the copolymer, (3) optionally, a free radical initiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (4) optionally, a co-agent in an amount of at least about 0.05 wt % based on the weight of the copolymer.

2. The module of claim 1 in which the electronic device is a solar cell.

3. The module of claim 1 in which the free radical initiator is present.

4. The module of claim 3 in which the coagent is present.

5. The module of claim 4 in which the free radical initiator is a peroxide.

6. The module of claim 1 in which the polymeric material is in the form of a monolayer film in intimate contact with at least one face surface of the electronic device.

7. The module of claim 1 in which the polymeric material further comprises a scorch inhibitor in an amount from about 0.01 to about 1.7 wt %.

8. The module of claim 1 further comprising at least one glass cover sheet.

9. The module of claim 3 in which the free radical initiator is a photoinitiator.

10. The module of claim 1 which the polymeric material further comprises a polyolefin polymer grafted with an unsaturated organic compound containing at least one ethylenic unsaturation and at least one carbonyl group.

11. The module of claim 10 in which the unsaturated organic compound is maleic anhydride.

12. The module of claim 1 in which the vinyl silane is present.

13. The module of claim 12 in which the vinyl silane is at least one of vinyl tri-ethoxy silane and vinyl tri-methoxy silane.

14. The module of claim 13 in which the co-agent is present.

15. The module of claim 13 in which the polyolefin copolymer is crosslinked such that that the copolymer contains less than about 85 percent xylene soluble extractables as measured by ASTM 2765-95.

16. The module of claim 13 in which the polymeric material is in the form of a monolayer film in intimate contact with at least one face surface of the electronic device.

17. The module of claim 13 in which the polymeric material further comprises a scorch inhibitor in an amount from about 0.01 to about 1.7 wt %.

18. The module of claim 13 further comprising at least one glass cover sheet.

19. The module of claim 13 in which the polymeric material further comprises a polyolefin polymer grafted with an unsaturated organic compound containing at least one ethylenic unsaturation and at least one carbonyl group.

20. The module of claim 19 in which the unsaturated organic compound is maleic anhydride.