Insole and Shoe Comprising an Electronic Chip

• US 20110296714A1
• Filed: 06/02/2010
• Published: 12/08/2011
• Est. Priority Date: 06/02/2010
• Status: Active Grant

• Current Assignee: Cairos Technologies Ag
• Original Assignee: Cairos Technologies Ag
• Inventors: Holzer, Christian
• Granted Patent: US 8,584,382 B2
• Time in Patent Office: Days
• US Class Current: 36/132
• CPC Class Codes: A43B 17/00 Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
• CPC Class Codes: A43B 3/34 with electrical or electronic arrangements

Abstract

The present invention relates to an insole, in particular for a sports shoe, and shoe comprising an electronic chip. In order to provide a shoe, in particular a sports shoe, with an electronic chip in a more cost efficient way compared to the prior art, wherein the chip can easily be replaced or removed in case of failure or for recycling, the invention provides an insole, in particular for a sports shoe, wherein the insole comprises an electronic chip. The insole may be fitted into any kinds of shoes and may be readily replaced or removed, as is not an inherent part of the shoe.

Claims

1. Insole (1), in particular for a sports shoe, characterized by said insole (1) comprising an electronic chip (2).

2. Insole (1) according to claim 1, characterized by said chip (2) is embodied as a microprocessor and/or an active and/or passive transponder chip.

3. Insole (1) according to one of the preceding claims, characterized by said chip (2) is accommodated in a heel portion (3), in an arch portion (4) and/or in a ball portion (5) of said insole (1).

4. Insole (1) according to one of the preceding claims, characterized by a body of said insole (1) is made by foaming, casting, injection molding, laminating, punching, stamping and/or cutting, wherein said chip (2) is preferably integrally formed with or detachably combined with said insole body.

5. Insole (1) according to one of the preceding claims, characterized by said chip (2) is accommodated between different layers (6, 7) of said insole (1).

6. Insole (1) according to one of the preceding claims, characterized by said chip (2) or a module (10) comprising said chip (2) is received within a receptacle (8) of the insole (1).

7. Insole (1) according to one of the preceding claims, characterized by said receptacle (8) receives said chip (2) or module (10) comprising said chip (2) from a top side (A) from or a bottom side (B) of said insole (1).

8. Insole (1) according to one of the preceding claims, characterized by said chip (2) or module (10) comprising said chip (2) fits into said receptacle (8) such that it completely closes, fills and/or seals said receptacle (8), wherein the surface of chip (2) or module (10) is preferably flush with an adjacent surface of the insole (1).

9. Insole (1) according to one of the preceding claims, characterized by said chip (2) or module (10) comprising said chip (2) and an insole body are substantially made from the same material, preferably plastic, most preferably ethylenvinylacetate (EVA), polyurethane (PU) and/or silicone.

10. Insole (1) according to one of the preceding claims, characterized by said insole (1) comprising energy generation and/or storage means powering said chip (2), preferably a battery, most preferably a button type battery (9).

11. Insole (1) according to one of the preceding claims, characterized by said chip (2) and/or said energy generation means and/or said energy storage means is sealed in a watertight fashion.

12. Shoe (11), in particular sports shoe, comprising a module (10) provided with an electronic chip (2), wherein said module (10) is detachably combined with said shoe (11), characterized by said module (10) is inserted and removed through the opening (12) that receives a foot of a user of said shoe (11).

13. Shoe (11) according to claim 12, characterized by said module (10) can be received in a receptacle (8) of said shoe (11).

14. Shoe (11) according to claim 13, characterized by said receptacle (8) is provided on an insole (1), a lining (13), a tongue (14), an instep (15) or a sole (16) of said shoe (11).

15. Method of manufacturing an insole (1) comprising an electronic chip (2), wherein a body of said insole (1) is made by foaming, casting, injection molding, laminating, punching, stamping and/or cutting, wherein the chip (2) is integrally formed or detachably combined with said insole body.