MICRO-CHIMNEY AND THERMOSIPHON DIE-LEVEL COOLING
First Claim
Patent Images
1. A structure comprising:
- a die with at least one via within the die, the conduit being proximate to a hot spot, the via being at least partially filled with a heat-dissipating material; and
the via being capable of absorbing heat from the hot spot.
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Abstract
A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.
91 Citations
7 Claims
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1. A structure comprising:
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a die with at least one via within the die, the conduit being proximate to a hot spot, the via being at least partially filled with a heat-dissipating material; and the via being capable of absorbing heat from the hot spot. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification