Electromechanic Microsensor

• US 20110308314A1
• Filed: 02/03/2010
• Published: 12/22/2011
• Est. Priority Date: 02/27/2009
• Status: Active Grant

• Current Assignee: Hanking Electronics Hongkong Company Limited
• Original Assignee: Sensordynamics AG
• Inventors: Kempe, Volker
• Granted Patent: US 8,850,886 B2
• Time in Patent Office: Days
• US Class Current: 73/504.02
• CPC Class Codes: G01C 19/574 the devices having two sensing masses in anti-phase motion

Abstract

The invention relates to an electromechanic microsensor (MEMS) (1) comprising drive elements (2, 3, 4) which are moved linearly in an x-y plane and disposed on a substrate for determining at least two, preferably three, components of the yaw rate vector of the substrate, wherein two groups of drive elements (2, 3; 4) exist, which are driven essentially in directions running essentially at right angles to each other. The electromechanic microsensor (MEMS) (1) according to the invention is characterized in that the drive elements (2, 4; 3, 4) which are moved at right angles to each other are connected to one another for synchronizing the movements by means of a coupling device (6, 7) that is rotatably mounted on the substrate.

Claims

1. Micro-electro-mechanical sensor (MEMS) (1) with drive elements (2, 3, 4) that move linearly along an x-y plane, arranged on a substrate for determining at least two, preferably three, components of the substrate'"'"'s yaw rate vector, wherein two groups of drive elements (2, 3;

4) exist that are essentially driven in directions perpendicularly to each other, characterized in that the drive elements (2, 4;

3, 4) that move perpendicularly to each other are connected to one another by means of a coupling device (6, 7) rotatably arranged on the substrate for synchronizing the movements.

2-18. -18. (canceled)