SENSING MODULE FOR ORTHOPEDIC LOAD SENSING INSERT DEVICE

• US 20110319755A1
• Filed: 06/29/2010
• Published: 12/29/2011
• Est. Priority Date: 06/29/2010
• Status: Active Grant

• Current Assignee: Howmedica Osteonics Corp. (Stryker Corporation)
• Original Assignee: OrthoSensor, Inc (Stryker Corporation)
• Inventors: Stein, Marc, Ellis, Jim, Roche, Martin
• Granted Patent: US 8,979,758 B2
• Time in Patent Office: Days
• US Class Current: 600/437
• CPC Class Codes: A61B 2562/0219 Inertial sensors, e.g. accelerometers, gyroscopes, tilt switches
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/0252 Load cells
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/4528 Joints A61B5/4533, A61B5/4538 take precedence
• CPC Class Codes: A61B 5/4585 Evaluating the knee
• CPC Class Codes: A61B 5/4851 Prosthesis assessment or monitoring
• CPC Class Codes: A61B 8/0875 for diagnosis of bone A61B5/4504 takes precedence
• CPC Class Codes: A61B 8/4472 Wireless probes
• CPC Class Codes: A61F 2/389 Tibial components A61F2/3868 takes precedence
• CPC Class Codes: A61F 2/4657 Measuring instruments used for implanting artificial joints for surgical instruments A61B90/06
• CPC Class Codes: A61F 2002/3067 for data transfer
• CPC Class Codes: A61F 2002/3895 unicompartimental
• CPC Class Codes: A61F 2002/4666 for measuring force, pressure or mechanical tension

Abstract

A sensing insert device (100) is disclosed for measuring a parameter of the muscular-skeletal system. The sensing insert device (100) can be temporary or permanent. The sensing module (200) is a self-contained encapsulated measurement device having at least one contacting surface that couples to the muscular-skeletal system. The sensing module (200) comprises one or more sensing assemblages (1802), electronic circuitry (307), an antenna (2302), and communication circuitry (320). The sensing assemblages (1802) are between a top plate (1502) and a bottom plate (1504) in a sensing platform (121). The bottom plate (1504) is supported by a ledge (1708) on an interior surface of a sidewall (1716) of a housing (1706). A cap (1702) couples to top plate (1502). The cap (1702) is adhesively coupled to the housing (1706). The adhesive is flexible allowing movement of the cap (1702) when a force, pressure, or load is applied thereto.

Claims

1. A sensing module for measuring a parameter of the muscular-skeletal system comprising:

a sensing platform to measure a force, pressure, or load; and

a housing including at least one support structure interior to the housing where the sensing platform is supported by the at least one support structure.

2. The sensing module of claim 1 where the at least one support structure is a ledge formed on an interior sidewall of the housing and where the sensing platform is supported by the ledge a predetermined distance above a bottom surface of the housing.

3. The sensing module of claim 2 further including electronic circuitry operatively coupled to the sensing platform where the electronic circuitry resides between the sensing platform and the bottom surface of the housing.

4. The sensing module of claim 3 further including a printed circuit board supported by a support structure of the housing a predetermined distance from the bottom surface of the housing.

5. The sensing module of claim 1 further including a cap overlying the sensing platform.

6. The sensing module of claim 5 where an adhesive seals the cap to the housing thereby forming an encapsulated enclosure and where the cap is movable under a force, pressure, or load applied thereto.

7. The sensing module of claim 1 where the sensing platform measures a transit time, frequency, or phase.

8. The sensing module of claim 7 where the sensing platform further includes:

a waveguide; and

at least one transducer to emit energy waves into the waveguide and to detect propagated energy waves.

9. The sensing module of claim 1 where the sensing module is in a trial insert that is dimensionally substantially equal to the final insert.

10. The sensing module of claim 1 where the sensing module is in a final insert.

11. A sensing module for measuring a parameter of the muscular-skeletal system comprising an encapsulating enclosure having therein a sensing platform overlying electronic circuitry operatively coupled for parameter measurement.

12. The sensing module of claim 11 where the sensing platform comprises:

a first support structure;

a second support structure; and

at least one sensing assemblage coupled between the first and second support structures.

13. The sensing module of claim 12 where the encapsulating structure includes a housing and where the housing includes at least one support structure interior to the housing that supports the second support structure of the sensing platform.

14. The sensing module of claim 13 further including a cap coupled to the first support structure where the cap and the first structure is movable in relation to the housing when a force, pressure, or load is applied thereto.

15. The sensing module of claim 14 further including an adhesive coupling the cap to the housing where the adhesive is flexible allowing movement of the cap in relation to the housing.

16. An prosthetic component for measuring a parameter of the muscular-skeletal system comprising:

an insert having substantial equal dimensions to a final insert for permanent implantation in the muscular-skeletal system where the insert has a first major surface and a second major surface where the insert when inserted allows articulation of the muscular-skeletal system; and

a sensing platform having a first surface and a second surface for receiving a force, pressure, or load applied thereacross where the first surface and second surface respectively couple to the first and second major surfaces of the insert.

17. The prosthetic component of claim 16 further including an encapsulating enclosure enclosing the sensing platform.

18. The prosthetic component of claim 17 where the encapsulating enclosure comprises

a housing;

and

a cap where the housing includes at least one support structure interior to the housing that supports the second surface of the sensing platform, where the cap couples to the first surface of the sensing platform, and where the cap moves in relation to the housing when the force, pressure, or load is applied thereto.

19. The prosthetic component of claim 18 where electronic circuitry operatively coupled to the sensing platform is between the second surface of the sensing platform and a bottom of the housing.

20. The prosthetic component of claim 19 where the sensing platform includes three or more sensing assemblages for taking parameter measurements at three or more predetermined locations of the first surface to determine a location on the first surface where the parameter is applied.