Methods and systems for measurement and control of process parameters

• US 20110320060A1
• Filed: 06/25/2010
• Published: 12/29/2011
• Est. Priority Date: 06/25/2010
• Status: Active Grant

• Current Assignee: Campbell Soup Company
• Original Assignee: Campbell Soup Company
• Inventors: Batmaz, Ediz, Mohammed, Rasheed, Abdelrahim, Khalid, Karkache, Mohammed
• Granted Patent: US 8,463,423 B2
• Time in Patent Office: Days
• US Class Current: 700/299
• CPC Class Codes: G01K 1/024 for remote indication
• CPC Class Codes: G01K 13/02 for measuring temperature of moving fluids or granular materials capable of flow
• CPC Class Codes: G01K 2207/02 for measuring food temperature

Abstract

Systems and methods for monitoring various process parameters, primarily in connection with processes for the sterilization of particulate foods in a continuous thermal process, make use of application specific integrated circuits (ASIC) that provide process-related data for batch or continuous thermal treatment when the circuit is embedded in a particle subjected to such treatment. The preferred methods are described in connection with process design, and with at least near real-time process control using process data provided by such circuits.

Claims

1. A system for monitoring at least one process condition of a batch or continuous thermal treatment, said system comprising:

(a) at least one application specific integrated circuit identifiable by radio frequency signal;

(b) said circuit having at least one sensor capable of measuring at least one process condition;

(c) at least one transceiver capable of communication with said circuit; and

(d) at least one particle embedded with said circuit, said particle further being within a heterogeneous fluid having a plurality of constituent particles.

2. The system of claim 1, wherein said process condition is selected from the group consisting of liquid pH, particulate temperature, liquid temperature, particulate speed, liquid speed, liquid nutrient characteristics, system pressure, particulate orientation, particulate position, and liquid salinity.

3. The system of claim 1, wherein said process condition is particulate temperature or liquid temperature, and wherein said temperature is measured from about −

40°

C. to about 200°

C.

4. The system of claim 1, wherein said process condition is particulate temperature or liquid temperature, and wherein said temperature is measured from 100°

C. to 140°

C.

5. The system of claim 1, wherein said process condition is particulate temperature or liquid temperature, and wherein said temperature measurement is accurate within 1°

C.

6. The system of claim 1, wherein said process condition is system pressure, and wherein said system pressure is measured up to 1 kpsi.

7. The system of claim 1, wherein said process condition is system pressure, and wherein said system pressure is measured up to 150 kpsi.

8. The system of claim 1, wherein said particle has a center, and wherein said circuit is located at least near the center of said particle.

9. The system of claim 1, wherein said circuit is located within a native constituent food particle.

10. The system of claim 1, wherein said circuit is located within said particle, and said particle emulates at least one physical characteristic of a native constituent food particle.

11. The system of claim 10, wherein said physical characteristic is selected from the group consisting of geometry, density, and volume.

12. The system of claim 1, wherein said circuit is located within said particle, and said particle emulates at least one thermal characteristic of a native constituent food particle.

13. The system of claim 12, wherein said thermal characteristic is selected from the group consisting of thermal diffusivity, thermal conductivity, and specific heat capacity.

14. The system of claim 1, wherein a measurement of said at least one process condition is logged along at least a portion of a process path defined for said thermal treatment, at at-least one discrete location along said process path, or along at least said portion of said process path defined for said thermal treatment and said at-least one discrete location along said process path.

15. The method of claim 14, wherein said measurement of said at least one process condition provides at least near real-time feedback to control at least one process condition.

16. A method of measuring process conditions of a batch or continuous thermal treatment, said method comprising the steps of:

(a) providing at least one application specific integrated circuit identifiable by radio frequency signal having at least one sensor capable of measuring at least one process condition;

(b) providing said circuit within a heterogeneous fluid associated with said batch or continuous thermal treatment; and

(c) measuring said at least one process condition as determined by said circuit at-least one discrete location.

17. The method of claim 16, which further includes the step of using said measured process condition to provide at least near real-time feedback for controlling said at least one process condition.

18. The method of claim 17, wherein said measured process condition is temperature.

19. The method of claim 17, wherein said measured process condition is associated with an aseptic process.

20. The method of claim 17, wherein said measured process condition is associated with a non-aseptic process.

21. The method of claim 16, which further includes the step of measuring said at least one process condition in a resistive or radiation heating process.

22. The method of claim 16, which further includes the step of embedding at least one circuit in at least one particle within said heterogeneous fluid, and wherein said heterogenous fluid has a plurality of constituent particles.

23. The method of claim 22, wherein said particle emulates at least one characteristic of a native constituent particle selected from the group consisting of physical, thermal, and dielectric characteristics.

24. The method of claim 23, wherein said selected characteristic is a dielectric characteristic, and wherein said dielectric characteristic is electrical conductivity.

25. The method of claim 16, wherein said thermal treatment is selected from the group consisting of sterilization treatment, pasteurization treatment, and preservation treatment.

26. The method of claim 16, which further includes the step of logging said measured process condition along at least a portion of a process path defined for said thermal treatment, at-least one discrete location along said process path, or along at least said portion of said process path defined for said thermal treatment and said at-least one discrete location along said process path.