ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF
First Claim
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1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
- providing an interposer;
forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and
attaching a component on the interposer in the encapsulant cavity.
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Abstract
A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
9 Citations
10 Claims
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1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
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providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity. - View Dependent Claims (2, 3, 4, 5)
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6. An encapsulant cavity integrated circuit package system comprising:
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an interposer; a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and a component on the interposer in the encapsulant cavity. - View Dependent Claims (7, 8, 9, 10)
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Specification