PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING THE SAME

• US 20120033395A1
• Filed: 07/25/2011
• Published: 02/09/2012
• Est. Priority Date: 08/06/2010
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: ISHII, Jun, IHARA, Terukazu, TERADA, Naohiro
• Granted Patent: US 8,658,906 B2
• Time in Patent Office: Days
• US Class Current: 361/784
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

Claims

1. A printed circuit board assembly sheet comprising:

a plurality of printed circuit boards;

a support frame configured to integrally support said plurality of printed circuit boards such that said plurality of printed circuit boards are arranged at spacings; and

a dummy trace portion provided in a region between at least a printed circuit board on one end side and said support frame, wherein

each of said plurality of printed circuit boards and said dummy trace portion includes;

a support substrate;

a first insulating layer formed on said support substrate;

a plurality of conductor traces formed on said first insulating layer; and

a second insulating layer formed on said first insulating layer to cover said plurality of conductor traces, and

at least one of said first and second insulating layers in said dummy trace portion has a groove.

2. The printed circuit board assembly sheet according to claim 1, wherein said groove is formed in said second insulating layer in a region between adjacent conductor traces in said dummy trace portion.

3. The printed circuit board assembly sheet according to claim 1, wherein said groove is formed in said first insulating layer in a region between adjacent conductor traces in said dummy trace portion.

4. The printed circuit board assembly sheet according to claim 1, wherein an opening is further formed in said support substrate in said dummy trace portion.

5. The printed circuit board assembly sheet according to claim 1, wherein

said support frame has a pair of first frame portions that are substantially parallel to each other, and a pair of second frame portions that are substantially perpendicular to said first frame portions, and said plurality of printed circuit boards are provided to be arranged in a direction parallel to said pair of first frame portions, and

said dummy trace portion is provided in a region between at least the printed circuit board on the one end side and one of said pair of second frame portions, and said conductor traces and said groove in said dummy trace portion are formed to extend in a direction from one of said first frame portions to the other one of said first frame portions.

6. The printed circuit board assembly sheet according to claim 1, wherein said printed circuit board is a suspension board with circuit.

7. A method of manufacturing a printed circuit board assembly sheet that includes a plurality of printed circuit boards, a support frame configured to integrally support said plurality of printed circuit boards such that said plurality of printed circuit boards are arranged at spacings, and a dummy trace portion provided in a region between at least a printed circuit board on one end side and said support frame, comprising the steps of:

forming first insulating layers, which correspond to said plurality of printed circuit boards and said dummy trace portion, on a support substrate;

forming a plurality of conductor traces on each of the first insulating layers corresponding to said plurality of printed circuit boards and the first insulating layer corresponding to said dummy trace portion; and

forming second insulating layers on said first insulating layers to cover the plurality of conductor traces corresponding to said plurality of printed circuit boards and the conductor trace corresponding to said dummy trace portion, respectively, wherein

at least one of said first and second insulating layers in said dummy trace portion has a groove.

8. The method of manufacturing the printed circuit board assembly sheet according to claim 7, wherein said step of forming the second insulating layer includes forming said groove in said second insulating layer in a region between adjacent conductor traces in said dummy trace portion.

9. The method of manufacturing the printed circuit board assembly sheet according to claim 7, wherein said step of forming the first insulating layer includes forming said groove in said first insulating layer in a region between adjacent conductor traces in said dummy trace portion.

10. The method of manufacturing the printed circuit board assembly sheet according to claim 7, further comprising the step of forming an opening in said support substrate in said dummy trace portion.