PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME

  • US 20120049695A1
  • Filed: 08/19/2011
  • Published: 03/01/2012
  • Est. Priority Date: 08/24/2010
  • Status: Active Grant
First Claim
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1. A method for manufacturing a piezoelectric device, comprising:

  • preparing a base wafer including multiple package bases each having a first main surface including respective external electrodes and a second main surface opposite the first main surface, the second main surface including a respective peripheral sealing surface, the base wafer also defining at least a pair of respective through-holes located between adjacent package bases wherein each through-hole extends from the first main surface to the second main surface, each package base when assembled with a package lid forming a respective package defining an interior cavity;

    attaching a respective piezoelectric vibrating piece to each package base, each vibrating piece including a respective pair of excitation electrodes;

    preparing a lid wafer including multiple package lids, each package lid having a first main surface and a second main surface opposite the first main surface, the second main surface including a respective peripheral sealing surface;

    applying a sealing material onto the peripheral sealing surfaces of the package bases or onto the peripheral sealing surfaces of the package lids, the sealing material being applied as a continuous circumferential band having a predetermined width and including a communicating groove allowing temporary pneumatic communication to and from the interior cavity via the through-hole; and

    in a vacuum or inert-gas atmosphere, allowing gaseous exchange to and from the cavities via the respective communicating grooves and through-holes while applying heat and compression, the heat and compression bonding the wafers together while allowing flow of sealing material into at least a portion of the communicating grooves sufficient to seal the cavities after the gaseous exchange.

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