WIRELESS POWER SUPPLY SYSTEM AND MULTI-LAYER SHIM ASSEMBLY

• US 20120049991A1
• Filed: 08/25/2011
• Published: 03/01/2012
• Est. Priority Date: 08/25/2010
• Status: Active Grant

• Current Assignee: Philips IP Ventures B.V. (Koninklijke Philips N.V.)
• Original Assignee: Access Business Group International LLC (Alticor Incorporated)
• Inventors: Baarman, David W., Stoner, William T. Jr., Moes, Benjamin C., Schwannecke, Joshua K., Van Den Brink, Joseph C., Kuyvenhoven, Neil W.
• Granted Patent: US 9,209,627 B2
• Time in Patent Office: Days
• US Class Current: 336/199
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 27/022 Encapsulation
• CPC Class Codes: H01F 27/04 Leading of conductors or axles through casings, e.g. for tap-changing arrangements
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/402 the two or more transmitting or the two or more receiving devices being integrated in the same unit, e.g. power mats with several coils or antennas with several sub-antennas
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 50/90 involving detection or optimisation of position, e.g. alignment
• CPC Class Codes: H02J 7/00308 Overvoltage protection
• CPC Class Codes: H02J 7/0044 specially adapted for holding portable devices containing batteries H02J7/0045 takes precedence
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

A wireless power supply includes a multi-layer shim assembly. Each shim aids in alignment of coils and routing of conductors in a multi-layer coil array. A shield or PCB can be used as part of the multi-layer shim assembly. Wires can be routed through channels to the edge of the shim assembly or wires can protrude through a portion of the multi-layer shim assembly. Traces can be used to route current through the multi-layer shim assembly. Plastic shims can be created by over-molding coils with plastic.

Claims

1. A multi-layer shim assembly for use in aligning a plurality of wireless power coils, said multi-layer shim assembly comprising:

a first shim layer including a first guide portion for aligning a first subset of said plurality of wireless power coils and a first routing portion for routing electrical connections from said first subset of said plurality of wireless power coils;

a second shim layer joined with said first shim layer, said second shim layer including a second guide portion for aligning a second subset of said plurality of wireless power coils and a second routing portion for routing electrical connections from said second subset of said plurality of wireless power coils.

2. The multi-layer shim assembly of claim 1 wherein said first shim layer is constructed from a non-conductive material.

3. The multi-layer shim assembly of claim 1 wherein said first shim layer is at least partially constructed from a flux concentrating material, wherein said flux concentrating material increases inductance of said plurality of wireless power coils and enhances a flux path within said multi-layer shim assembly.

4. The multi-layer shim assembly of claim 1 wherein said first shim layer is at least partially constructed from a shielding material, wherein said guide portion includes at least one of a bump, post, peg, and extrusion constructed from a flux concentrating material.

5. The multi-layer shim assembly of claim 1 wherein said first shim layer is a printed circuit board.

6. The multi-layer shim assembly of claim 1 wherein said first guide portion includes a cavity shaped to define a position for each of said first subset of said plurality of wireless power coils, and wherein said second guide portion includes a cavity shaped to define a position for each of said second subset of said plurality of wireless power coils.

7. The multi-layer shim assembly of claim 1 wherein said first guide portion includes a plurality of pairs of termination points for aligning said first subset of said plurality of wireless power coils and said first routing portion includes a stamped trace network between said plurality of pairs of termination points and a plurality of pairs of termination points for connection to wireless power circuitry.

8. The multi-layer shim assembly of claim 1 wherein said first guide portion and said second guide portion cooperate to align said plurality of wireless power coils in a predefined, overlapping, coil array.

9. The multi-layer shim assembly of claim 1 wherein said first routing portion and said second routing portion include a channel system for routing wires between said plurality of wireless power coils and an edge of said shim.

10. The multi-layer shim assembly of claim 1 wherein said at least one of said first routing portion and said second routing portion includes a stamped trace for routing power between an edge of said multi-layer shim assembly and a plurality of connection points for said plurality of wireless power coils.

11. The multi-layer shim assembly of claim 10 wherein said stamped trace is over molded into at least one of said first shim layer and said second shim layer.

12. The multi-layer shim assembly of claim 1 wherein said first guide portion includes an embossed pattern shaped to accept said first subset of said plurality of wireless power coils.

13. The multi-layer shim assembly of claim 1 wherein leads from each of said first subset of said plurality of wireless power coils are routed along a surface of said first shim layer for connection to wireless power circuitry.

14. The multi-layer shim assembly of claim 13 wherein said leads from each of said first subset of said plurality of wireless power coils are routed around a shield for connection to a printed circuit board.

15. The multi-layer shim assembly of claim 13 wherein leads from each of said plurality of wireless power coils are routed to a connector, said connector capable of electrically connecting said plurality of wireless power coils to wireless power circuitry.

23. The multi-layer shim assembly of claim 13 wherein said printed circuit board trace network provides an electrical connection between said second subset of said plurality of wireless power coils and a plurality of connection points for wireless power circuitry and said printed circuit board trace network provides an electrical connection between said first routing portion and said plurality of connection points for wireless power circuitry.

16. A multi-layer shim assembly for use in aligning a plurality of wireless power coils, said multi-layer shim assembly comprising:

a first shim layer including a first guide portion for aligning a first subset of said plurality of wireless power coils and a first routing portion for routing electrical connections from said first subset of said plurality of wireless power coils; and

a printed circuit board forming a second shim layer including a second subset of said plurality of wireless power coils printed on said printed circuit board and a second routing portion including a printed circuit board trace network.

17. The multi-layer shim assembly of claim 16 wherein at least a portion of said first shim layer is constructed from a flux concentrating material.

18. The multi-layer shim assembly of claim 16 wherein said first guide portion aligns said first subset of said plurality of wireless power coils in a predefined, overlapping, array with respect to said second subset of said plurality of wireless power coils.

19. The multi-layer shim assembly of claim 16 wherein said first routing portion includes a channel system for routing wires between said first plurality of wireless power coils and said printed circuit board.

20. The multi-layer shim assembly of claim 16 wherein said first routing portion includes a stamped trace for routing power between said first subset of said plurality of wireless power coils and said printed circuit board.

21. The multi-layer shim assembly of claim 20 wherein said stamped trace is over molded into said first shim layer.

22. The multi-layer shim assembly of claim 16 wherein said first guide portion includes at least one of a cavity shaped to define a position for each of said first subset of said plurality of wireless power coils and an embossed pattern shaped to accept said first subset of said plurality of wireless power coils.

24. A method of manufacturing a wireless power supply using a multi-layer shim assembly, said wireless power supply including wireless power circuitry capable of transferring wireless power via a plurality of wireless power coils, said method comprising:

providing a housing;

mounting a first shim layer of the multi-layer shim assembly in the housing, the first shim layer including a first guide portion and a first routing portion;

aligning a first subset of the plurality of wireless power coils in the first shim layer using the first guide portion;

routing electrical connections from said first subset of said plurality of wireless power coils;

mounting a second shim layer of the multi-layer shim assembly adjacent to the first shim layer, said second shim layer including a second guide portion and a second routing portion;

aligning said second subset of said plurality of wireless power coils in the second shim layer;

routing electrical connections from said second subset of said plurality of wireless power coils.

25. The method of claim 24 wherein mounting the first shim layer of the multi-layer shim assembly in the housing includes mounting the first shim layer to an electromagnetic shield.

26. The method of claim 25 wherein said wireless power circuitry is mounted to the electromagnetic shield, opposite the first shim layer of the multi-layer shim assembly.

27. The method of claim 24 wherein said routing electrical connections includes routing electrical connections from said second subset of said plurality of wireless power coils through an aperture in the multi-layer shim assembly to said wireless power circuitry.

28. The method of claim 24 wherein said routing electrical connections includes routing electrical connections from said first subset of said plurality of wireless power coils to said wireless power circuitry by connecting leads from the first subset of the plurality of wireless power coils to a stamped trace in the first shim layer, wherein said stamped trace in the first shim layer is in direct or indirect electrical communication with the wireless power circuitry.

29. A multi-layer overmolded shim assembly for use in aligning a plurality of wireless power coils, said multi-layer overmolded shim assembly comprising:

a first overmolded shim layer including a first subset of said plurality of wireless power coils, each of said first subset of said plurality of wireless power coils including a pair of coil leads;

a second overmolded shim layer adjacent said first overmolded shim layer, said second overmolded shim layer including a second subset of said plurality of wireless power coils, each of said second subset of said plurality of wireless power coils including a pair of coil leads;

a shield layer adjacent to said second overmolded shim layer;

an alignment system for aligning said first subset of said plurality of wireless power coils and said second subset of said plurality of wireless power coils in a multi-layer wireless power coil array, said alignment system including alignment features in said first overmolded shim layer, said second overmolded shim layer, and said shield layer; and

a routing system for routing electrical connections from said first subset of said plurality of wireless power coil leads and second subset of said plurality of wireless power coil leads, said routing system including routing features in said first overmolded shim layer, said second overmolded shim layer, and said shield layer.

30. The multi-layer overmolded shim assembly of claim 29 wherein said routing features include an aperture in said second overmolded shim layer through which said pair of coil leads from each of said first subset of said plurality of wireless power coils are routed, and an aperture in said shield layer through which said pair of coil leads from each of said first subset of said plurality of wireless power coils and from each of said second subset of said plurality of wireless power coils are routed and connect to a printed circuit board.

31. The multi-layer overmolded shim assembly of claim 29 wherein said alignment features include a plurality of rigid protrusions in said first overmolded shim layer, a plurality of apertures in said second overmolded shim layer for accepting said plurality of rigid protrusions, and a plurality of apertures in said shield layer for accepting said plurality of rigid protrusions, wherein said protrusions mate with said plurality of apertures in said second overmolded shim layer and said plurality of apertures in said shield layer to align said plurality of wireless power coils.

32. The multi-layer overmolded shim assembly of claim 31 wherein said routing features in said first overmolded shim layer include routing said plurality of coil leads through said plurality of rigid protrusions, and routing said coil leads through said plurality of apertures in said second overmolded shim layer and said shield layer.

33. The multi-layer overmolded shim assembly of claim 29 wherein said routing features include conductive traces that route electrical connections through at least one of said first overmolded shim layer, said second overmolded shim layer, and said shield layer.

34. The multi-layer overmolded shim assembly of claim 29 wherein said coil leads from each of said first subset of said plurality of wireless power coils are electrically joined to separate metallic tabs that protrude through said first overmolded shim layer.

35. The multi-layer overmolded shim assembly of claim 29 wherein at least one of said first overmolded shim layer and said second overmolded shim layer include flux concentrating material to increase inductance of said plurality of wireless power coils and enhance a flux path within said multi-layer overmolded shim assembly.

36. The multi-layer overmolded shim assembly of claim 29 wherein said pair of coil leads from each of said first subset of said plurality of wireless power coils are routed to pass through a common aperture to reduce common mode impedance.

37. The multi-layer overmolded shim assembly of claim 29 wherein said alignment features include mechanical connectors for joining at least two of said first overmolded shim layer, said second overmolded shim layer, and said shield layer.

38. The multi-layer overmolded shim assembly of claim 29 wherein said alignment features include a plurality of apertures in said second overmolded shim layer, each of said plurality of apertures positioned inside one of said wireless power coils in said second subset of said plurality of wireless power coils, whereby said apertures cooperate with other alignment features to align the plurality of wireless power coils.

39. The multi-layer overmolded shim assembly of claim 29 wherein each of said wireless power coils are individually overmolded.

40. The multi-layer overmolded shim assembly of claim 29 wherein each wireless power coil is overmolded with at least one of plastic and resin.

41. The multi-layer overmolded shim assembly of claim 29 wherein said first overmolded shim layer is overmolded with at least one of a plastic and resin and said second overmolded shim layer is overmolded with at least one of a plastic and resin.

42. The shim system of claim 29 wherein wireless power circuitry is joined to the multi-layer shim assembly and the multi-layer shim assembly is overmolded to form an outer housing of a wireless power supply.