COMPLIANT PRINTED FLEXIBLE CIRCUIT

• US 20120055702A1
• Filed: 05/27/2010
• Published: 03/08/2012
• Est. Priority Date: 06/02/2009
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Granted Patent: US 9,414,500 B2
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0221 Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
• CPC Class Codes: H05K 1/0256 Electrical insulation details, e.g. around high voltage areas
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0344 Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/09109 Locally detached layers, e.g. in multilayer
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence
• CPC Class Codes: H05K 3/1258 : by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
• CPC Class Codes: H05K 3/207 : using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: H05K 3/246 : Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
• CPC Class Codes: H05K 3/28 : Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/4007 : Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: H05K 3/4664 : Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4694 : Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density H05K3/4691 takes precedence
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

A compliant printed flexible circuit including a flexible polymeric film and at least one dielectric layer bonded to the polymeric film with recesses corresponding to a target circuit geometry. A conductive material is printed in at least a portion of the recesses to form a circuit geometry. At least one dielectric covering layer is printed over at least the circuit geometry. Openings can be printed in the dielectric covering layer to provide access to at least a portion of the circuit geometry.

Claims

1-40. -40. (canceled)

41. A compliant printed flexible circuit comprising:

a flexible polymeric film;

at least one dielectric layer selectively printed on the polymeric film with recesses corresponding to a target circuit geometry;

a conductive material printed in at least a portion of the recesses comprising a circuit geometry;

at least one dielectric covering layer printed over the conductive material; and

at least one opening in the dielectric covering layer providing access to at least a portion of the circuit geometry.

42. The compliant printed flexible circuit of claim 41 comprising a conductive plating layer on at least a portion of the circuit geometry.

43. The compliant printed flexible circuit of claim 41 wherein the conductive material comprises one of sintered conductive particles or a conductive ink.

44. The compliant printed flexible circuit of claim 41 comprising a compliant material located between the polymeric film and at least a portion of the circuit geometry.

45. The compliant printed flexible circuit of claim 41 comprising a compliant material generally aligned with the opening in the dielectric layer and positioned between the polymeric film and at least a portion of the circuit geometry.

46. The compliant printed flexible circuit of claim 41 comprising at least one printed electrical device on one of a dielectric layer or the polymeric film and electrically coupled to at least a portion of the circuit geometry.

47. The compliant printed flexible circuit of claim 41 comprising an optical quality material deposited in at least a portion of the recesses comprising one or more optical circuit geometries.

48. The compliant printed flexible circuit of claim 41 comprising one or more optical fibers located in at least a portion of the recesses comprising one or more optical circuit geometries.

49. The compliant printed flexible circuit of claim 41 wherein at least a portion of the circuit geometry comprises a via electrically coupling adjacent layers of the circuit geometry.

50. The compliant printed flexible circuit of claim 41 comprising one or more contact members electrically coupled to at least a portion of the circuit geometry and extending above the dielectric covering layer.

51. The compliant printed flexible circuit of claim 50 wherein the compliant printed flexible circuit is singulated adjacent at least one of the contact members.

52. The compliant printed flexible circuit of claim 41 comprising:

at least one contact member extending along a first surface of the compliant printed flexible circuit; and

at least one printed compliant member located on a second surface of the compliant printed flexible circuit opposite at least one of the contact members.

53. The compliant printed flexible circuit of claim 41 wherein conductive traces in the circuit geometry comprise substantially rectangular cross-sectional shapes.

54. The compliant printed flexible circuit of claim 41 wherein a conductive material, a non-conductive material, and a semi-conductive material are printed on a single layer.

55. An edge connector on the compliant printed flexible circuit of claim 41 comprising:

a first portion of the circuit geometry extending beyond the dielectric covering layer;

a compliant material located along a surface of the first portion of the circuit geometry; and

a second portion of the circuit geometry located on top of the compliant material.

56. An electrical interconnect assembly comprising:

a housing retaining the compliant printed flexible circuit of claim 41;

a first circuit member comprising electrical contacts compressively engaged with contact members located along a first surface of the compliant printed flexible circuit; and

a second circuit member comprising electrical contacts compressively engaged with contact members located along a second surface of the compliant printed flexible circuit.

57. The electrical interconnect assembly of claim 56 wherein the first and second circuit members are selected from one of a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.

58. The compliant printed flexible circuit of claim 41 comprising:

at least one opening extending through the compliant printed flexible circuit; and

at least one contact member inserted in the opening and electrically coupled to at least a portion of the circuit geometry.

59. A method of making a compliant printed flexible circuit comprising:

selectively printing at least one dielectric layer to a flexible polymeric film to create recesses corresponding to a target circuit geometry;

printing a conductive material in at least a portion of the recesses comprising a circuit geometry; and

printing at least one dielectric covering layer over at least the circuit geometry.

60. The method of claim 59 comprising printing the dielectric covering layer with at least one opening that provides access to at least a portion of the circuit geometry.

61. The method of claim 59 comprising plating a conductive material on at least a portion of the circuit geometry.

62. The method of claim 59 wherein printing the conductive material comprises:

printing a conductive material in the recesses; and

sintering the conductive material.

63. The method of claim 59 wherein printing the conductive material comprises printing a conductive ink in the recesses.

64. The method of claim 59 comprising printing a compliant material in a location between the polymeric film and at least a portion of the circuit geometry.

65. The method of claim 64 comprising aligning the printed compliant material with an opening in the dielectric covering layer.

66. The method of claim 59 comprising:

printing at least one electrical device on one of a dielectric layer or the polymeric film; and

electrically coupled the electrical device to at least a portion of the circuit geometry.

67. The method of claim 59 comprising printing an optical quality material in at least a portion of the recesses comprising one or more optical circuit geometries.

68. The method of claim 59 comprising locating one or more optical fibers in at least a portion of the recesses comprising one or more optical circuit geometries.

69. The method of claim 59 comprising printing at least one via in a dielectric layer to electrically couple adjacent layers of the circuit geometry.

70. The method of claim 59 comprising printing one or more contact members that extends above the dielectric covering layer and electrically couple to at least a portion of the circuit geometry.

71. The method of claim 70 comprising singulating at least a portion of the compliant printed flexible circuit adjacent at least one of the contact members.

72. The method of claim 59 comprising:

printing one or more contact members that extend above a first surface of the compliant printed flexible circuit and electrically couple to at least a portion of the circuit geometry; and

printing at least one compliant member on a second surface of the compliant printed flexible circuit opposite at least one of the contact members.

73. The method of claim 59 wherein conductive traces in the circuit geometry comprise substantially rectangular cross-sectional shapes.

74. The method of claim 59 comprising printing a conductive material, a non-conductive material, and a semi-conductive material is printed on a single layer.

75. The method of claim 59 comprising the steps of:

locating pre-formed conductive trace materials in the recesses; and

plating the recesses to form conductive traces with substantially rectangular cross-sectional shapes.

76. The method of claim 59 comprising the steps of:

pressing a conductive foil into at least a portion of the recesses;

shearing the conductive foil along edges of the recesses;

removing excess conductive foil not located in the recesses; and

plating the recesses to form conductive traces with substantially rectangular cross-sectional shapes.

77. A method of making an edge connector for a compliant printed flexible circuit made according to claim 59 comprising the steps of:

printing a first portion of the circuit geometry beyond the dielectric covering layer;

printing a compliant material along a surface of the first portion of the circuit geometry; and

printing a second portion of the circuit geometry on top of the compliant material.

78. A method of making an electrical interconnect assembly comprising the steps of:

retaining a compliant printed flexible circuit made according to the method of claim 59 in a housing;

compressively coupling electrical contacts on a first circuit member with contact members located along a first surface of the compliant printed flexible circuit; and

compressively coupling electrical contacts on a second circuit member with contact members located along a second surface of the compliant printed flexible circuit.

79. The method of claim 78 wherein the first and second circuit members are selected from one of a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.

80. The method of claim 59 comprising the steps of:

printing at least one opening extending through the compliant printed flexible circuit; and

inserting at least one contact member into the opening and electrically coupling the contact member with at least a portion of the circuit geometry.