LED MODULE FOR MODIFIED LAMPS AND MODIFIED LED LAMP

• US 20120068204A1
• Filed: 02/26/2010
• Published: 03/22/2012
• Est. Priority Date: 03/09/2009
• Status: Active Grant

• Current Assignee: Tridonic Jennersdorf GMBH (Zumtobel Group AG)
• Original Assignee: Tridonic Jennersdorf GMBH (Zumtobel Group AG)
• Inventors: Pachler, Peter
• Granted Patent: US 9,203,001 B2
• Time in Patent Office: Days
• US Class Current: 257/89
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An LED module includes a printed circuit board (PCB) or a surface mount device (SMD) mount, an LED chip mounted on the PCB or the SMD mount, a cover mounted on the LED chip and a surface of the PCB or the SMD mount which surrounds the LED chip. The surface of the PCB or the SMD mount on which the spherical cover is mounted may be covered on its side walls with a white reflective material which is in contact with the LED chip.

Claims

1-13. -13. (canceled)

14. An LED module comprising:

a printed circuit board (PCB) or a surface mount device (SMD) mount;

an LED chip mounted on the PCB or the SMD mount; and

a cover mounted on the LED chip and a surface of the PCB or the SMD mount which surrounds the LED chip,

wherein the surface of the PCB or the SMD mount on which the spherical cover is mounted is covered on its side walls with a white reflective material which is in contact with the LED chip.

15. The LED module as claimed in claim 14, wherein the reflective material is a layer which has a thickness of between 5 μ

m and 250 μ

m.

16. The LED module as claimed in claim 14, wherein the reflective material comprises a layer whose upper surface is lower than the upper surface of the LED chip when the LED module is viewed from the side with the LED chip on the PCB or the SMD mount.

17. The LED module as claimed in claim 16, wherein the reflective material comprises a layer whose thickness is between 75% and 90% of the thickness of the LED chip.

18. The LED module as claimed in claim 14, wherein a lateral side wall of the LED chip is coated with a material which is arranged such that it is reflective for the light which strikes the LED chip.

19. The LED module as claimed in claim 14, wherein a color conversion material is provided in the cover and/or on an upper surface of the LED chip.

20. The LED module as claimed in claim 19, wherein the reflective material is reflective at least for a spectrum which is emitted from the LED chip and the color conversion material.

21. The LED module as claimed in one of claim 20, wherein the LED module emits essentially white light, which is a mixture from the spectrum of the LED chip and an emission spectrum of the color conversion material.

22. The LED module as claimed in one of claims 21, wherein the reflective material is an electrically non-conductive material.

23. The LED module as claimed in claim 14, wherein a multiplicity of LED chips are arranged under the cover.

24. The LED module as claimed in claim 23, wherein the LED chip emits a spectrum which is partially converted down by a phosphor, and the LED module includes a further LED chip that emits a spectrum which is not significantly adversely affected by the phosphor.

25. A modified LED lamp which has at least one LED module as claimed in claim 24.

26. An LED lamp comprising:

an LED module which has a printed circuit board (PCB) or a surface mount device (SMD) mount and a multiplicity of LED chips which are mounted on the PCB or the SMD mount; and

a spherical cover disposed or mounted on the multiplicity of LED chips and on a surface of the PCB or the SMD mount which surrounds the multiplicity of LED chips,

wherein at least one LED chip of the multiplicity of LED chips emits blue light which is partially converted by a phosphor, and wherein at least one LED chip of the multiplicity of LED chips emits light in the red spectrum, which is not significantly adversely affected by the phosphor.

27. The LED module as claimed in claim 26, wherein the reflective material comprises a layer which has a thickness of between 100 μ

m and 150 μ

m.

28. The LED module as claimed in claim 26, wherein the reflective material comprises a layer whose upper surface is lower than an upper surface of the multiplicity of LED chips when the LED module is viewed from the side with the multiplicity of LED chips on the PCB or SMD mount.

29. The LED module as claimed in claim 26, wherein the reflective material comprises a layer whose thickness is between 75% and 90% of the thickness of the an LED chip of the multiplicity of LED chips.

30. The LED module as claimed in claim 26, wherein a lateral side wall of the multiplicity of LED chips is likewise coated with a material which is arranged such that it is reflective for light which strikes the multiplicity of LED chips.

31. The LED module as claimed in claim 26, wherein a color conversion material is provided in the spherical cover and/or on an upper surface of the multiplicity of LED chips.

32. The LED module as claimed in claim 31, wherein the reflective material is reflective at least for a spectrum which is emitted from the multiplicity of LED chips and the color conversion material.

33. The LED module as claimed in one of claim 32, wherein the LED module emits essentially white light, which is a mixture of the spectrum of the multiplicity of LED chips and an emission spectrum of the color conversion material.