METHOD FOR PRODUCING A LIGHT-EMITTING DIODE
First Claim
1. A method for producing a light-emitting diode comprising:
- providing a light-emitting diode chip comprising a semiconductor body, andapplying a luminescence conversion material to an outer area of the semiconductor body by thermal spraying such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material, orproviding a radiation-transmissive carrier,applying a luminescence conversion material to an outer area of the carrier by thermal spraying, andarranging the carrier at a radiation exit area of the light-emitting diode chip such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material.
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Accused Products
Abstract
A method for producing a light-emitting diode includes providing a light-emitting diode chip including a semiconductor body, and applying a luminescence conversion material to an outer area of the semiconductor body by thermal spraying such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material, or providing a radiation-transmissive carrier, applying a luminescence conversion material to an outer area of the carrier by thermal spraying, and arranging the carrier at a radiation exit area of the light-emitting diode chip such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material.
13 Citations
17 Claims
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1. A method for producing a light-emitting diode comprising:
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providing a light-emitting diode chip comprising a semiconductor body, and applying a luminescence conversion material to an outer area of the semiconductor body by thermal spraying such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material, or providing a radiation-transmissive carrier, applying a luminescence conversion material to an outer area of the carrier by thermal spraying, and arranging the carrier at a radiation exit area of the light-emitting diode chip such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 16, 17)
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2. (canceled)
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13. A method for producing a light-emitting diode comprising:
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providing a light-emitting diode chip comprising a semiconductor body, and applying a luminescence conversion material to an outer area of the semiconductor body by thermal spraying such that at least part of electromagnetic radiation generated during operation of the light-emitting diode impinges on the luminescence conversion material, wherein the light-emitting diode chip comprises a semiconductor body comprising a plurality of semiconductor layers grown epitaxially and at least one active region in which electromagnetic radiation is generated during operation of the light-emitting diode chip, and after the luminescence conversion material has been applied, part of the luminescence conversion material is removed. - View Dependent Claims (14, 15)
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Specification