LED LUMINAIRE

• US 20120075854A1
• Filed: 09/28/2011
• Published: 03/29/2012
• Est. Priority Date: 09/28/2010
• Status: Active Grant

• Current Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Original Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Inventors: Maxik, Fredric S., Bartine, David E., Grove, Eliza Katar, Schellack, James, Soler, Robert
• Granted Patent: US 8,272,762 B2
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 19/0055 by screwing
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21Y 2107/40 on the sides of polyhedrons, e.g. cubes or pyramids
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0278 Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A luminaire includes an electrical base, an optic, and a heat sink disposed between the base and the optic. An LED driver circuit is disposed at least partially within the heat sink, and is disposed in electrical communication with the base. An LED light source is disposed in thermal communication with one or more surfaces of the heat sink, and in electrical communication with the driver circuit, the LED assembly includes an LED module. The light source includes a printed circuit board with a plurality of projections that are bendable such that the projections are arranged on an angle when assembled on the heat sink.

Claims

1. A luminaire, comprising:

an electrical base;

a driver circuit in electrical communication with the electrical base;

an optic;

a heat sink disposed between the electrical base and the optic, the heat sink having a plurality of first surfaces, each of the plurality of first surfaces being disposed non-planar with respect to each other; and

,

a light emitting diode (LED) light source having a plurality of second surfaces disposed non-planar with respect to each other and disposed in thermal communication with a respective one of the plurality of first surfaces, the LED light source further having a plurality of third surfaces opposite the plurality of second surfaces and having at least one LED member coupled thereon, each LED member being disposed in electrical communication with the driver circuit.

2. The luminaire of claim 1 wherein the plurality of third surfaces are disposed on an angle of 45-85 degrees relative to a plane substantially perpendicular to a longitudinal axis of the luminaire.

3. The luminaire of claim 2 wherein the plurality of third surfaces are disposed on a 75 degree angle relative to the plane.

4. The luminaire of claim 2 wherein the optic includes a prismatic lens and the plurality of third surfaces are disposed on a 45 degree angle relative to the plane.

5. The luminaire of claim 1 wherein the plurality of third surfaces includes four surfaces and each of the LED members emits light on a 120 degree arc.

6. The luminaire of claim 1 wherein the plurality of third surfaces includes three surfaces and each of the LED members emits light on a 150 degree arc.

7. The luminaire of claim 1 wherein the LED light source includes a fourth surface that is substantially planer with a longitudinal axis of the luminaire and the plurality of second surfaces are contiguous with and extend from the fourth surface.

8. The luminaire of claim 7 wherein the plurality of second surfaces each include at least one circuit trace member that extends from each of the plurality of second surfaces to the fourth surface.

9. The luminaire of claim 1 wherein the heat sink includes a plurality of ribs with a plurality of gaps disposed therebetween, wherein the plurality of third surfaces are positioned such that a portion of light emitted from each the at least one LED members are transmitted through the plurality of gaps.

10. A luminaire comprising:

an electrical base;

an optic;

a heat sink coupled between the electrical base and the optic, the heat sink having a first surface on one end within the optic and a plurality of second surfaces disposed about the first surface wherein the plurality of second surfaces are on an 45-85 degree angle relative to the first surface; and

,

an LED light source having a plurality of third surfaces disposed parallel to the plurality of second surfaces, the plurality of second surfaces being thermally coupled to the plurality of second surfaces, the LED light source further having a plurality of LED members operably coupled to the plurality of third surfaces, wherein at least one of the plurality of LED members is associated with each of the plurality of third surfaces.

11. The luminaire of claim 10 wherein the plurality of second surfaces are each disposed on a 65-85 degree angle relative to the first surface.

12. The luminaire of claim 11 wherein the plurality of second surfaces is disposed on substantially a 75 degree angle relative to the first surface.

13. The luminaire of claim 10 wherein:

the optic includes a prismatic lens; and

,

wherein the plurality of second surfaces are each disposed on substantially a 45 degree angle relative to the first surface.

14. A luminaire comprising:

an electrical base;

an optic;

a heat sink coupled between the electrical base and the optic, the heat sink having a first portion disposed within the optic and a second portion having a plurality of ribs, the first portion having a plurality of first surfaces disposed at substantially a 45-85 degree angle relative to a plane perpendicular to a longitudinal axis; and

,

an LED light source thermally coupled to the heat sink, the LED light source comprising a printed circuit board (PCB) and a plurality of LED members, the PCB having at least three second surfaces, each of the at least three second surfaces being disposed at an angle substantially parallel to and in thermal contact with one of the plurality of first surfaces.

15. The luminaire of claim 14 wherein the PCB includes a fourth surface parallel to the plane and at least three score portions, each of the at least three score portions being disposed between one of the at least three second surfaces and the fourth surface.

16. The luminaire of claim 15 wherein the plurality of LED members are disposed on each of the at least three second surfaces and the fourth surface.

17. The luminaire of claim 14 wherein:

the heat sink includes a plurality of openings adjacent the plurality of first surfaces; and

,

each of the at least three second surfaces includes a portion, each of the portions being disposed in one of the plurality of openings.

18. A method of fabricating an LED assembly for a luminaire comprising:

forming a flat PCB having a first side and a second side;

scoring the flat PCB on the first side to define a plurality of surfaces;

mounting a plurality of LED members to the flat PCB, wherein at least one of the plurality of LED members is mounted to each of the plurality of surfaces; and

,

bending the plurality of surfaces to a predefined angle.

19. The method of claim 18 further comprising:

wherein the scoring includes forming a v-score;

forming electrical traces on the second side of the flat PCB; and

,

mounting the PCB to a heat sink.

20. The method of claim 19 wherein the step of mounting the PCB to the heat sink includes the step of inserting a portion of the plurality of surfaces into one of a plurality of openings in the heat sink.