ARRAY OF BAW RESONATORS WITH MASK CONTROLLED RESONANT FREQUENCIES

• US 20120079692A1
• Filed: 12/15/2011
• Published: 04/05/2012
• Est. Priority Date: 03/11/2009
• Status: Active Grant

• Current Assignee: Cymatics Laboratories Corp.
• Original Assignee: Cymatics Laboratories Corp.
• Inventors: Sinha, Rajarishi, Carley, L. Richard, Kim, Deok-Yang
• Granted Patent: US 9,362,880 B2
• Time in Patent Office: Days
• US Class Current: 29/25.35
• CPC Class Codes: H03H 2003/027 the resonators or networks being of the microelectro-mechanical [MEMS] type
• CPC Class Codes: H03H 2003/0414 Resonance frequency
• CPC Class Codes: H03H 2003/0442 of a non-piezoelectric layer
• CPC Class Codes: H03H 2003/045 Modification of the area of an element
• CPC Class Codes: H03H 2003/0478 in a process for mass production
• CPC Class Codes: H03H 3/007 for the manufacture of electromechanical resonators or networks
• CPC Class Codes: H03H 3/0076 for obtaining desired frequency or temperature coefficients
• CPC Class Codes: H03H 3/02 for the manufacture of piezoelectric or electrostrictive resonators or networks H03H3/08 takes precedence
• CPC Class Codes: H03H 3/04 for obtaining desired frequency or temperature coefficient
• CPC Class Codes: H03H 9/15 Constructional features of resonators consisting of piezoelectric or electrostrictive material H03H9/25 takes precedence
• CPC Class Codes: H03H 9/171 implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
• CPC Class Codes: H03H 9/205 having multiple resonators crystal tuning forks H03H9/21
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49009 Dynamoelectric machine
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

Methods that create an array of BAW resonators by patterning a mass load layer to control the resonant frequency of the resonators and resonators formed thereby, are disclosed. Patterning the surface of a mass load layer and introducing apertures with dimensions smaller than the acoustic wavelength, or dimpling the mass load layer, modifies the acoustic path length of the resonator, thereby changing the resonant frequency of the device. Patterns of variable density allow for further tuning the resonators and for individualized tuning of a resonator in an array of resonators. Patterning a reflowable material for the mass load layer, thereby providing a variable pattern density and distribution followed by elevating the temperature of the mass load layer above its melting point causes the material to liquefy and fill into the apertures to redistribute the mass load layer, thereby, upon subsequent cooling, providing resonators with a predetermined desired resonant frequency.

Claims

1. A method for forming a resonator comprising:

forming a first conductive layer on a substrate;

forming a layer for converting one of electrical energy or mechanical energy to the other on the first conductive layer;

forming over said layer for converting one of electrical energy or mechanical energy to the other a mass load layer for adjusting the acoustic path length of the resonator to achieve a desired predetermined resonant frequency;

patterning the mass load layer by one of adding material thereto or removing portions therefrom to form apertures therein that extend at least one of either partially into or entirely through the mass load layer; and

forming a second conductive layer on the mass load layer, wherein at least a portion of the apertures that extend entirely through the mass load layer are filled by the second conductive layer material.

2. The method of claim 1 wherein the layer for converting one of electrical energy or mechanical energy to the other is a piezoelectric layer.

3. The method of claim 2 wherein the first and second conductive layers are first and second electrodes.

4. The method of claim 3 wherein the resonator is a resonator array.

5. The method of claim 1 wherein the second conductive layer at least partially fills the apertures in the mass load layer.

6. The method of claim 3 wherein the patterned mass load layer has apertures therein at least a portion thereof having dimensions smaller than the acoustic wavelength of a thickness-extensional mode or a length-extensional mode of the resonator.

7. The method of claim 4 wherein the pattern of the mass load layer of a first resonator in the array has a first pattern density and the pattern of the mass load layer for a second resonator in the array has a second pattern density different from the first pattern density, wherein the pattern density is selected to impart a predetermined acoustic path length to each resonator.

8. The method of claim 3 wherein the pattern of the mass load layer has a variable density.

9. The method of claim 1 wherein the resonator is a bulk acoustic-wave resonator.

10. The method of claim 1, further comprising forming an etch stop layer on the layer for converting one of electrical energy or mechanical energy to the other and forming the mass load layer over the etch stop layer.

11. The method of claim 1, wherein the mass load layer is patterned using a single lithography step followed by a single etch step.

12. The method of claim 1 further comprising forming a temperature drift compensating layer in the resonator.

13. The method of claim 1 further comprising heating the mass load layer to a deformable or flowable state such that the patterned mass load layer at least partially moves into the apertures therein.

14. A method for forming a resonator comprising:

forming a first conductive layer on a substrate;

forming a piezoelectric material over the first conductive layer;

forming a second conductive layer over the piezoelectric layer;

forming over said second conductive layer a mass load layer;

patterning the mass load layer by adding material to or removing portions from, thereby introducing apertures into the mass load layer, wherein the apertures extend only partially through the mass load layer, wherein the pattern is selected to provide a predetermined resonant frequency to the resonator.

15. The method of claim 14 wherein the resonator is an array of resonators.

16. The method of claim 15 wherein at least a portion of the apertures in the patterned mass load layer have dimensions smaller than the acoustic wavelength of a thickness-extensional mode or a length-extensional mode of the resonator.

17. The method of claim 15 wherein the pattern of the mass load layer of a first resonator in the array has a first pattern density and the pattern of the mass load layer for a second resonator in the array has second pattern density different from the first pattern density, wherein the pattern density is selected to impart a predetermined acoustic path length to the resonator.

18. The method of claim 14 wherein the pattern of the mass load layer has a variable density.

19. A method for forming a resonator comprising:

forming a first conductive layer on a substrate;

forming a piezoelectric material over the first conductive layer;

forming a second conductive layer over the piezoelectric layer;

forming over said piezoelectric layer a mass load layer for adjusting the incremental acoustic path of the resonator to achieve a desired predetermined change in the acoustic path length of the resonator;

patterning the mass load layer by removing portions thereof, thereby introducing apertures into the mass load layer; and

heating the mass load layer to a deformable or flowable state such that the patterned mass load layer at least partially moves into the removed portions.

20. The method of claim 19 further comprises cooling the mass load layer after the heating step.