PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF

• US 20120097435A1
• Filed: 04/30/2010
• Published: 04/26/2012
• Est. Priority Date: 04/30/2009
• Status: Active Grant

• Current Assignee: PI R&D Co.,Ltd.
• Original Assignee: PI R&D Co.,Ltd.
• Inventors: Goshima, Toshiyuki, Win, Maw Soe, Segawa, Sigemasa, Kyo, Eika
• Granted Patent: US 8,859,170 B2
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: C08G 18/10 Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
• CPC Class Codes: C08G 18/346 having four carboxylic acid groups
• CPC Class Codes: C08G 18/44 Polycarbonates
• CPC Class Codes: C08G 18/73 acyclic
• CPC Class Codes: C08G 18/7678 containing condensed aromatic rings
• CPC Class Codes: C08G 73/1035 from tetracarboxylic acids or derivatives and diisocyanates
• CPC Class Codes: C08G 73/1042 Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: G03F 7/0233 characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 3/287 Photosensitive compositions
• CPC Class Codes: Y10S 430/107 Polyamide or polyurethane

Abstract

Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.

Claims

1. A photosensitive modified polyimide resin composition, which comprises a modified polyimide represented by the following Formula (I):

2. The composition according to claim 1, wherein said photosensitizer is a positive-type photosensitizer.

3. The composition according to claim 1 or 2, wherein said modified polyimide represented by said Formula (I) further comprises a reactive group at a terminal thereof to have thermosetting property.

4. The composition according to claim 1, wherein the weight ratio of the repeating units whose number is represented by said n in said Formula (I) to said modified polyimide represented by said Formula (I) is 0.3 to 0.7 (with the proviso that the weight of Y is excluded when Y is aromatic).

5. The photosensitive modified polyimide resin composition according to claim 1, wherein said photosensitizer is naphthoquinone diazide sulfonyl ester, which is an aromatic polyhydroxy compound, or a quinonediazidc compound.

6. The composition according to claim 1, which further comprises 1 to 20 parts by weight of a non-halogen-based flame retardant with respect to 100 parts by weight of said modified polyimide.

7. The composition according to claim 6, wherein said non-halogen-based flame retardant is a hydrated metal compound such as a non-halogen metal hydroxide, a phosphate compound or a phosphazene compound.

8. A photosensitive resin film, which is obtained by forming a film of the composition according to claim 1 and heating the thus obtained film to remove said solvent.

9. A method of preparing a patterned polyimide resin film, which comprises the steps of:

coating the composition according to claim 1 on a substrate to foun a film;

heating the thus obtained film to remove said solvent;

exposing through a mask said composition from which said solvent was removed;

developing the resultant after said exposure; and

, after said development, heating the resultant to a temperature not lower than the curing temperature of said curing agent.

10. The method according to claim 9, wherein said substrate is a printed circuit board or FPC board having wiring formed thereon.

11. A printed circuit board or FPC, which comprises a patterned polyimide resin film prepared by the method according to claim 10.