Optoelectronic Component, and Method for the Production of an Optoelectronic Component

• US 20120112337A1
• Filed: 08/20/2009
• Published: 05/10/2012
• Est. Priority Date: 09/04/2008
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Groetsch, Stefan, Zeiler, Thomas, Zitzlsperger, Michael, Jaeger, Harald
• Granted Patent: US 8,502,252 B2
• Time in Patent Office: Days
• US Class Current: 257/712
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.

Claims

1. An optoelectronic component comprising:

at least two connecters for electrical contacting of the component;

a housing body, in which the connecters are embedded in places; and

a heat sink, which is connected to at least one of the connecters, wherein

the housing body is formed of a plastics material,

the housing body comprises an opening, in which the heat sink is freely accessible in places,

at least one optoelectronic semiconductor chip is arranged in the opening on the heat sink, and

at least two of the connecters each comprise a chip-end portion, which faces the at least one optoelectronic semiconductor chip, wherein the chip-end portions of the at least two connecters are arranged in a common plane.

2. The optoelectronic component according to claim 1, wherein the plastics material of the housing body is epoxy resin or contains epoxy resin.

3. The optoelectronic component according to claim 1, wherein the plastics material of the housing body is silicone or contains silicone.

4. The optoelectronic component according to claim 1, wherein the heat sink comprises:

a top face, on which the at least one optoelectronic semiconductor chip is placed,

a bottom face, remote from the top face, and

a side face, which connects together the top face and the bottom face, wherein the side face is free of the plastics material of the housing body.

5. The optoelectronic component according to claim 1, wherein the heat sink projects laterally beyond the housing body in a fastening portion of the heat sink.

6. The optoelectronic component according to claim 5, wherein the heat sink comprises an opening in the fastening portion, which opening is intended for accommodating a fastening means.

7. The optoelectronic component according to claim 1, wherein at least one of the connecters is configured in a connecting portion remote from its chip-end portion as a soldering lug.

8. The optoelectronic component according to claim 1, wherein at least one of the connecters is configured in a connecting portion remote from its chip-end portion as a plug for a plug-and-socket connection.

9. The optoelectronic component according to claim 1, wherein the at least one of the connecters extends in its connecting portion transversely of the fastening portion of the heat sink.

10. The optoelectronic component according to claim 1, comprising at least three connecters.

11. The optoelectronic component according to claim 10, wherein at least two connecters are welded together with the heat sink.

12. The optoelectronic component according to claim 1, comprising at least four optoelectronic semiconductor chips.

13. A method of producing an optoelectronic semiconductor component according to claim 1, comprising the following steps in the following sequence:

providing at least two connecters;

connecting at least one connecter to a heat sink;

producing a housing body, in which the connecters are embedded in places, an opening to the heat sink being provided in the housing body; and

fastening at least one optoelectronic semiconductor chip on the heat sink in the opening in the housing body.

14. A method according to claim 13, wherein the connecters are present in the carrier strip assembly.