WAFER MOLD MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

  • US 20120139131A1
  • Filed: 11/15/2011
  • Published: 06/07/2012
  • Est. Priority Date: 12/03/2010
  • Status: Abandoned Application
First Claim
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1. A wafer mold material for collectively subjecting a wafer having semiconductor devices on a surface thereof to resin molding,wherein the wafer mold material has a resin layer containing a filler and at least any one of an acrylic resin, a silicone resin having an epoxy group, an urethane resin, and a polyimide silicone resin, and the wafer mold material is formed into a film-like shape.

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