Radio-Frequency Packaging with Reduced RF Loss
First Claim
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1. A device comprising:
- an interposer comprising;
a first side and a second side opposite to the first side, wherein the interposer does not comprise through-interposer vias therein;
first passive devices on the first side of the interposer; and
second passive devices on the second side of the interposer, wherein the first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices; and
a radio-frequency (RF) device bonded to the first side of the interposer and electrically connected to the first passive devices.
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Abstract
A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The interposer does not have through-interposer vias formed therein. First passive devices are formed on the first side of the interposer and electrically coupled to the RF device. Second passive devices are formed on the second side of the interposer. The first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices.
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Citations
20 Claims
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1. A device comprising:
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an interposer comprising; a first side and a second side opposite to the first side, wherein the interposer does not comprise through-interposer vias therein; first passive devices on the first side of the interposer; and second passive devices on the second side of the interposer, wherein the first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices; and a radio-frequency (RF) device bonded to the first side of the interposer and electrically connected to the first passive devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A device comprising:
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a first interposer comprising a first side and a second side opposite to the first side; first passive devices on the first side of, and as a part of, the first interposer; a second interposer comprising a first side and a second side opposite to the first side, wherein the second side of the first interposer faces, and is attached to, the second side of the second interposer, and wherein no metal feature is disposed in the first and the second interposers; second passive devices on the first side of, and as a part of, the second interposer; a radio-frequency (RF) device bonded to the first side of the first interposer; and a package substrate bonded to the first side of the second interposer through a flip chip bonding, wherein the RF device is signally connected to the package substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A device comprising:
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an interposer comprising; a substrate; first passive devices on a first side of the substrate; and second passive devices on a second side of the substrate opposite the first side, wherein no metal features are formed in the substrate and connecting the first passive devices to the second passive devices; a radio-frequency (RF) device die bonded to the first side of the interposer; a package substrate bonded to the second side of the interposer; bond wires bonded to the package substrate and electrically coupled to the RF device die, wherein the RF device die is configured to be coupled to DC supplies through the bond wires, and wherein no bond wires bonded to the package substrate or the interposer are configured to transmit radio-frequency signals; and a printed circuit board (PCB) bonded to the package substrate through solder balls. - View Dependent Claims (18, 19, 20)
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Specification