ALUMINUM BONDING MEMBER AND METHOD FOR PRODUCING SAME

• US 20120152482A1
• Filed: 02/24/2012
• Published: 06/21/2012
• Est. Priority Date: 03/31/2004
• Status: Active Grant

• Current Assignee: DOWA Metaltech Co., Ltd. (DOWA Holdings Company Limited)
• Original Assignee: DOWA Metaltech Co., Ltd. (DOWA Holdings Company Limited)
• Inventors: Osanai, Hideyo
• Granted Patent: US 8,745,841 B2
• Time in Patent Office: Days
• US Class Current: 164/112
• CPC Class Codes: B22D 19/0072 for making objects with integrated channels
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49885 with coating before or during assembling
• CPC Class Codes: Y10T 29/4998 Combined manufacture including applying or shaping of fluent material
• CPC Class Codes: Y10T 29/49982 Coating
• CPC Class Codes: Y10T 29/49984 and casting

Abstract

There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding member 10 has an aluminum member 12 of aluminum or an aluminum alloy exposed to the outside, and a tubular member 14 of a material which does not melt at a temperature close to the melting point of aluminum or the aluminum alloy. Both of the opening end portions of the tubular member are open to the outside of the aluminum member 12. A portion of the tubular member 14 between the opening end portions extends in the aluminum member 12, and the outer peripheral surface of the portion of the tubular member 14 extending in the aluminum member 12 is bonded directly to the aluminum member 12.

Claims

1-11. -11. (canceled)

12. A method for producing an aluminum bonding member, said method comprising the steps of:

preparing a tubular member of a material which does not melt at a temperature close to a melting point of aluminum or an aluminum alloy;

putting said tubular member in a die so that opening end portions of the tubular member are open to the outside of the die;

injecting a molten metal of aluminum or the aluminum alloy into said die; and

cooling and solidifying the injected molten metal to cause a portion of said tubular member in said die to contact a solid aluminum member.

13. A method for producing an aluminum bonding member as set forth in claim 12, wherein said portion of said tubular member in the die is caused to contact said solid aluminum member to be bonded thereto.

14. A method for producing an aluminum bonding member as set forth in claim 13, which further comprises a step of arranging a metal/ceramic circuit board, which has a metal circuit plate bonded to a ceramic substrate, on said die so as to close an opening portion formed in a top face of the die, before injecting said molten metal, so that said metal/ceramic circuit board contacts said solid aluminum member to be bonded thereto when said portion of the tubular member in the die is caused to contact said solid aluminum member to be bonded thereto.

15. A method for producing an aluminum bonding member as set forth in claim 13, which further comprises a step of arranging a ceramic substrate in said die before injecting said molten metal, so that said solid aluminum member is caused to contact to one side of said ceramic substrate to be bonded thereto while an aluminum circuit plate is caused to contact the other side of said ceramic substrate to be bonded thereto when said portion of the tubular member in the die is caused to contact said solid aluminum member to be bonded thereto.

16. A method for producing an aluminum member as set forth in claim 15, wherein said ceramic substrate is caused to contact each of both sides of said solid aluminum member to be bonded thereto.

17. (canceled)