RFID TRANSPONDER AND METHOD FOR CONNECTING A SEMICONDUCTOR DIE TO AN ANTENNA

• US 20120193801A1
• Filed: 01/16/2012
• Published: 08/02/2012
• Est. Priority Date: 01/27/2011
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments Deutschland Gesellschaft Mit Beschrã¤Nkter Haftung (Texas Instruments, Inc.)
• Inventors: Gross, Johann, Lange, Bernhard
• Application Number:
  US13/351,104
• Publication Number:
  US 20120193801A1
• Time in Patent Office: Days
• US Class Current: 257/772
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

An RFID transponder having a semiconductor die with a solderable contact area and an antenna made from a winding wire, wherein the winding wire is soldered to the contact area, and the solderable contact area is made from a nickel based alloy.

Claims

1. An RFID transponder comprising:

a semiconductor die having a solderable contact area; and

an antenna made from a winding wire, wherein the winding wire is soldered to the contact area and the solderable contact area is made from a nickel based alloy.

2. The RFID transponder according to claim 1, wherein the nickel based alloy is NiAu or NiSn.

3. The RFID transponder according to claim 1, wherein the solder contact between the winding wire and the solderable contact area is made by laser soldering, hot stamping soldering or ultrasonic compression welding.

4. The RFID transponder according to claim 2, wherein the solder contact between the winding wire and the solderable contact area is made by laser soldering, hot stamping soldering or ultrasonic compression welding.

5. The RFID transponder according to claim 1, wherein the solderable contact area comprises a Sn finish.

6. The RFID transponder according to claim 2, wherein the solderable contact area comprises a Sn finish.

7. The RFID transponder according to claim 3, wherein the solderable contact area comprises a Sn finish.

8. The RFID transponder according to claim 1, wherein the winding wire insulation is stripped off using a laser.

9. A method for connecting a semiconductor die to a winding wire of an antenna comprising:

providing a solderable contact area on the die made from a nickel based alloy;

soldering the winding wire to the solderable contact area by using a hot stamping solder process or by ultrasonic compression welding.

10. The method of connecting a semiconductor die to a winding wire of an antenna according to claim 9, further comprising positioning the die and the winding wire relative to each other with a positioning stage, wherein the die is fixed to the positioning stage with the help of a vacuum holder.

11. The method of connecting a semiconductor die to a winding wire of an antenna according to claim 9, wherein the step of soldering is performed by laser soldering.

12. The method of connecting a semiconductor die to a winding wire of an antenna according to claim 9, further comprising the step of stripping off the winding wire insulation with the laser.

13. A method for connecting a semiconductor die to a winding wire of an antenna comprising:

providing a solderable contact area on the die made from a nickel based alloy;

soldering the winding wire to the solderable contact area by using a contact free connecting method.

14. The method of connecting a semiconductor die to a winding wire of an antenna according to claim 13, wherein the step of soldering is performed by laser soldering.

15. The method of connecting a semiconductor die to a winding wire of an antenna according to claim 14, further comprising the step of stripping off the winding wire insulation with the laser.

16. The method of connecting a semiconductor die to a winding wire of an antenna according to claim 13, further comprising positioning the die and the winding wire relative to each other with a positioning stage, wherein the die is fixed to the positioning stage with the help of a vacuum holder.