ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
First Claim
Patent Images
1. An electronic device comprising:
- an unpackaged inorganic light-emitting diode (LED) die having first and second distinct non-coplanar contacts on a first surface thereof; and
a yielding substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween,wherein the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces with a pressure-activated adhesive material notwithstanding the non-coplanarity of the first and second contacts, and without electrically bridging the traces or the contacts.
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Accused Products
Abstract
In accordance with certain embodiments, an unpackaged inorganic LED die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the unpackaged inorganic LED die or non-coplanarity of the contacts thereof.
22 Citations
30 Claims
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1. An electronic device comprising:
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an unpackaged inorganic light-emitting diode (LED) die having first and second distinct non-coplanar contacts on a first surface thereof; and a yielding substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween, wherein the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces with a pressure-activated adhesive material notwithstanding the non-coplanarity of the first and second contacts, and without electrically bridging the traces or the contacts. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. An electronic device comprising:
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a unpackaged inorganic LED die having first and second spaced-apart contacts on a first surface thereof; and a yielding substrate having first and second conductive traces on a first surface thereof in a bonding region, the first and second conductive traces defining a gap therebetween, wherein (i) the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces with a pressure-activated adhesive material without electrically bridging the traces or the contacts, and (ii) at least in the bonding region, a height of the first and second traces above the first surface of the substrate does not exceed 10 μ
m. - View Dependent Claims (29)
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30. An electronic device comprising:
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an unpackaged inorganic LED die comprising a plurality of active semiconductor layers and a plurality of contacts, a first and a second of the active semiconductor layers collectively defining a non-planar first surface to which a first and a second of the contacts are joined; and a yielding substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween, wherein the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces with a pressure-activated adhesive material notwithstanding the non-planarity of the first surface of the unpackaged inorganic LED die, and without electrically bridging the traces or the contacts.
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Specification