Capacitively Coupled Stripline to Microstrip Transition, and Antenna thereof

• US 20120256794A1
• Filed: 04/04/2012
• Published: 10/11/2012
• Est. Priority Date: 04/06/2011
• Status: Active Grant

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: Andrew LLC (CommScope Holding Company, Inc.)
• Inventors: Veihl, Jonathon C., He, Jinchun, Wen, Hangsheng
• Granted Patent: US 8,742,867 B2
• Time in Patent Office: Days
• US Class Current: 343/700.MS
• CPC Class Codes: H01P 5/028 between strip lines
• CPC Class Codes: H01P 5/08 for linking dissimilar lines or devices H01P1/16, H01P5/04 take precedence; linking lines of the same kind but with different dimensions H01P5/02

Abstract

The present invention provides a capacitively coupled stripline to microstrip transition which comprises a stripline, a microstrip, an upper conductive ground plane, a lower conductive ground plane, an insulating layer and an insulating fixing component. The stripline is positioned between the upper conductive ground plane and the lower conductive ground plane, and has a stripline overlap section. The microstrip is mounted on the upper conductive ground plane, and has a microstrip overlap section which penetrates the upper conductive ground plane. Wherein the microstrip overlap section, the insulating layer and the stripline overlap section are attached uniformly and tightly in sequence and fixed together by the insulating fixing component. The present invention further provides an antenna comprising this transition.

Claims

1. A capacitively coupled stripline to microstrip transition, comprising:

an upper conductive ground plane;

a lower conductive ground plane;

an insulating layer;

an insulating fixing component;

a stripline, positioned between the upper conductive ground plane and the lower conductive ground plane, and having a stripline overlap section;

a microstrip, mounted on the upper conductive ground plane, and having a microstrip overlap section which penetrates the upper conductive ground plane, wherein the microstrip overlap section, the insulating layer and the stripline overlap section are attached uniformly and tightly in sequence and fixed together by the insulating fixing component.

2. The capacitively coupled stripline to microstrip transition according to claim 1, wherein the microstrip further has a microstrip matching section which is located on the upper conductive ground plane, and the microstrip is mounted on the upper conductive ground plane through the microstrip matching section.

3. The capacitively coupled stripline to microstrip transition according to claim 1, wherein the microstrip overlap section, the insulating layer and the stripline overlap section are fixed to the lower conductive ground plane through the insulating fixing component.

4. The capacitively coupled stripline to microstrip transition according to claim 1, wherein the penetrating fixing end of the insulating fixing component penetrates the microstrip overlap section, the insulating layer and the stripline overlap section in sequence, or the penetrating fixing end of the insulating fixing component penetrates the stripline overlap section, the insulating layer and the microstrip overlap section in sequence, so as to fix the microstrip overlap section, the insulating layer and the stripline overlap section together.

5. The capacitively coupled stripline to microstrip transition according to claim 1, wherein the insulating fixing component is a plastic rivet, a plastic screw and its matching plastic nut, or a plastic snap-in fastener.

6. The capacitively coupled stripline to microstrip transition according to claim 5, wherein the plastic snap-in fastener is an inverted Y shaped snap-in fastener, the upper end of which penetrates the stripline overlap section, the insulating layer and the microstrip overlap section in sequence, so as to fix the microstrip overlap section, the insulating layer and the stripline overlap section together.

7. The capacitively coupled stripline to microstrip transition according to claim 6, wherein the two lower ends of the inverted Y shaped snap-in fastener are snapped in the lower conductive ground plane respectively so as to be fixed with the lower conductive ground plane.

8. The capacitively coupled stripline to microstrip transition according to claim 1, wherein the upper conductive ground plane and the lower conductive plane are metal plates.

9. The capacitively coupled stripline to microstrip transition according to claim 8, wherein the metal plates are aluminum plates.

10. The capacitively coupled stripline to microstrip transition according to claim 1, wherein the upper conductive ground plane has a perforation through which the microstrip overlap section penetrates the upper conductive ground plane.

11. The capacitively coupled stripline to microstrip transition according to claim 1, wherein the thickness d of the insulating layer typically meets the following relationship:

12. The capacitively coupled stripline to microstrip transition according to claim 11, wherein the thickness d of the insulating layer is 0.01˜

2 mm.

13. The capacitively coupled stripline to microstrip transition according to claim 11, wherein the thickness of the insulating layer d=0.05 mm, f=1710 MHz, ∈

₀=8.851×

10<sup>−

12</sup> F/m, ∈

_r=3.2, then A>

40 mm².

14. The capacitively coupled stripline to microstrip transition according to claim 1, wherein the insulating layer is a thin plastic gasket, a thin layer of conformal coat applied to the stripline overlap section or the microstrip overlap section, or a thin insulating layer applied to the stripline overlap section or the microstrip overlap section and created by a chemical process.

15. The capacitively coupled stripline to microstrip transition according to claim 14, wherein the thin plastic gasket is a polyester gasket.

16. The capacitively coupled stripline to microstrip transition according to claim 1, further comprising:

an insulating fixing element; and

a capacitive coupled grounding block, located between the upper conductive ground plane and the lower conductive ground plane, and fixed to the upper conductive ground plane and the lower conductive ground plane by the insulating fixing element, wherein the microstrip overlap section, the insulating layer and the stripline overlap section fixed together by the insulating fixing component are located in the capacitive coupled grounding block.

17. The capacitively coupled stripline to microstrip transition according to claim 16, wherein the capacitive coupled grounding block is designed to surround the overlap section of the microstrip and the stripline to prevent parallel plate mode and to contribute to broadening the bandwidth of the impedance match of the transition.

18. The capacitively coupled stripline to microstrip transition according to claim 16, wherein the stripline further has a stripline matching section which penetrates the capacitive coupled grounding block.

19. The capacitively coupled stripline to microstrip transition according to claim 16, wherein the insulating fixing element includes at least one insulating snap-in clip, which penetrates the upper conductive ground plane, the capacitive coupled grounding block and the lower conductive ground plane in sequence so as to fix the upper conductive ground plane, the capacitive coupled grounding block and the lower conductive ground plane by attaching the upper conductive ground plane, the capacitive coupled grounding block and the lower conductive ground plane uniformly and tightly in sequence.

20. The capacitively coupled stripline to microstrip transition according to claim 19, wherein the insulating snap-in clip is a plastic snap-in clip.

21. The capacitively coupled stripline to microstrip transition according to claim 20, wherein the plastic snap-in clip is a polycarbonate snap-in clip.

22. The capacitively coupled stripline to microstrip transition according to claim 16, further comprising:

an upper capacitive coupled grounding insulating layer, located between the upper conductive ground plane and the capacitive coupled grounding block, and fixed to the upper conductive ground plane and the capacitive coupled grounding block by the insulating fixing element; and

a lower capacitive coupled grounding insulating layer, located between the capacitive coupled grounding block and the lower conductive ground plane, and fixed to the capacitive coupled grounding block and the lower conductive ground plane by the insulating fixing element.

23. The capacitively coupled stripline to microstrip transition according to claim 22, wherein the upper capacitive coupled grounding insulating layer and the lower capacitive coupled grounding insulating layer are U-shaped capacitive coupled grounding insulating layers.

24. The capacitively coupled stripline to microstrip transition according to claim 1, wherein an opening is provided in the lower conductive ground plane and underneath the stripline overlap section.

25. A capacitively coupled stripline to microstrip transition, comprising:

an upper conductive ground plane;

a lower conductive ground plane;

an insulating layer;

an insulating fixing component;

a stripline, positioned between the upper conductive ground plane and the lower conductive ground plane, and having a stripline overlap section;

a microstrip, mounted on the upper conductive ground plane, and having a microstrip overlap section which penetrates the upper conductive ground plane, wherein the microstrip overlap section, the insulating layer and the stripline overlap section are attached uniformly and tightly in sequence and fixed together by the insulating fixing component;

an insulating fixing element;

a capacitive coupled grounding block, located between the upper conductive ground plane and the lower conductive ground plane, and fixed to the upper conductive ground plane and the lower conductive ground plane by the insulating fixing element, wherein the microstrip overlap section, the insulating layer and the stripline overlap section fixed together by the insulating fixing component are located in the capacitive coupled grounding block;

wherein the thickness d of the insulating layer typically meets the following relationship;

26. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the microstrip further has a microstrip matching section which is located on the upper conductive ground plane, and the microstrip is mounted on the upper conductive ground plane through the microstrip matching section.

27. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the microstrip overlap section, the insulating layer and the stripline overlap section are fixed to the lower conductive ground plane through the insulating fixing component.

28. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the penetrating fixing end of the insulating fixing component penetrates the microstrip overlap section, the insulating layer and the stripline overlap section in sequence, or the penetrating fixing end of the insulating fixing component penetrates the stripline overlap section, the insulating layer and the microstrip overlap section in sequence, so as to fix the microstrip overlap section, the insulating layer and the stripline overlap section together.

29. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the insulating fixing component is a plastic rivet, a plastic screw and its matching plastic nut, or a plastic snap-in fastener.

30. The capacitively coupled stripline to microstrip transition according to claim 29, wherein the plastic snap-in fastener is an inverted Y shaped snap-in fastener, the upper end of which penetrates the stripline overlap section, the insulating layer and the microstrip overlap section in sequence, so as to fix the microstrip overlap section, the insulating layer and the stripline overlap section together.

31. The capacitively coupled stripline to microstrip transition according to claim 30, wherein the two lower ends of the inverted Y shaped snap-in fastener are snapped in the lower conductive ground plane respectively so as to be fixed with the lower conductive ground plane.

32. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the upper conductive ground plane has a perforation through which the microstrip overlap section penetrates the upper conductive ground plane.

33. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the thickness d of the insulating layer is 0.01˜

2 mm.

34. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the thickness of the insulating layer d=0.05 mm, f=1710 MHz, ∈

₀=8.851×

10<sup>−

12</sup> F/m, ∈

_r=3.2, then A>

40 mm².

35. The capacitively coupled stripline to microstrip transition according to claim 26, wherein the capacitive coupled grounding block is designed to surround the microstrip overlap section and the stripline overlap section to prevent parallel plate mode and to contribute to broadening the bandwidth of the impedance match of the transition.

36. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the stripline further has a stripline matching section which penetrates the capacitive coupled grounding block.

37. The capacitively coupled stripline to microstrip transition according to claim 25, wherein the insulating fixing element includes at least one insulating snap-in clip, which penetrates the upper conductive ground plane, the capacitive coupled grounding block and the lower conductive ground plane in sequence so as to fix the upper conductive ground plane, the capacitive coupled grounding block and the lower conductive ground plane by attaching the upper conductive ground plane, the capacitive coupled grounding block and the lower conductive ground plane uniformly and tightly in sequence.

38. The capacitively coupled stripline to microstrip transition according to claim 25, further comprising:

an upper capacitive coupled grounding insulating layer, located between the upper conductive ground plane and the capacitive coupled grounding block, and fixed to the upper conductive ground plane and the capacitive coupled grounding block by the insulating fixing element; and

a lower capacitive coupled grounding insulating layer, located between the capacitive coupled grounding block and the lower conductive ground plane, and fixed to the capacitive coupled grounding block and the lower conductive ground plane by the insulating fixing element.

39. The capacitively coupled stripline to microstrip transition according to claim 38, wherein the upper capacitive coupled grounding insulating layer and the lower capacitive coupled grounding insulating layer are U-shaped capacitive coupled grounding insulating layers.

40. The capacitively coupled stripline to microstrip transition according to claim 25, wherein an opening is provided in the lower conductive ground plane and underneath the stripline overlap section.

41. An antenna, comprising a stripline and a microstrip, wherein the antenna further comprises:

an upper conductive ground plane;

a lower conductive ground plane;

an insulating layer;

an insulating fixing component;

wherein the stripline is positioned between the upper conductive ground plane and the lower conductive ground plane, and has a stripline overlap section;

the microstrip is mounted on the upper conductive ground plane, and has a microstrip overlap section which penetrates the upper conductive ground plane, the microstrip overlap section, the insulating layer and the stripline overlap section are attached uniformly and tightly in sequence and fixed together by the insulating fixing component.