APPARATUS FOR GRINDING HEATED PLANE OF COOLER

• US 20120276822A1
• Filed: 03/01/2012
• Published: 11/01/2012
• Est. Priority Date: 06/02/2009
• Status: Active Grant

• Current Assignee: Chen-Hsiang Lin, Chih-Hung Cheng, Jui-Ho Liu, Ken Hsu, Kuo-Len Lin
• Original Assignee: Chen-Hsiang Lin, Chih-Hung Cheng, Jui-Ho Liu, Ken Hsu, Kuo-Len Lin
• Inventors: LIN, Kuo-Len, Lin, Chen-Hsiang, Liu, Jui-Ho, Hsu, Ken, Cheng, Chih-Hung
• Granted Patent: US 8,328,601 B2
• Time in Patent Office: Days
• US Class Current: 451/259
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 37/12 Lapping plates for working plane surfaces
• CPC Class Codes: B24B 37/30 for single side lapping of plane surfaces
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 13/182 especially adapted for evaporator or condenser surfaces F28F13/187 takes precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Claims

1. An apparatus for grinding heated plane of cooler, in which a heated plane of a cooler is ground, and which includes:

a grinder having a grinding plate and an abrasive supply barrel that is arranged above the grinding plate for supplying an abrasive into a gap between the heated plane and the grinding plate; and

a fixture combined to the grinder and having at least one pressure plate for arranging the cooler;

thereby, the pressure plate pressing and clamping the cooler, making the heated plane contact closely to the abrasive.

2. The apparatus for grinding heated plane of cooler according to claim 1, wherein the grinder is arranged a fixing frame fixed to the grinder and at least one elastic element arranged between the fixture and the grinder for elastically arranging the fixture to the grinder.

3. The apparatus for grinding heated plane of cooler according to claim 2, wherein the grinder further includes a driving device arranged on the fixing frame and abutted against the fixture for driving the fixture elevated and lowered elastically to press and clamp the cooler.

4. The apparatus for grinding heated plane of cooler according to claim 1, wherein corresponding to the grinding plate, the fixture is shown as a disk configuration, a circumference of which is divided into equal parts to project out a plurality of pressure plates, at a bottom part of each of which at least one pointed bulge is arranged, which presses and clamps the cooler.

5. The apparatus for grinding heated plane of cooler according to claim 4, wherein the pressure plate presses and clamps the cooler via a point contact manner.

6. The apparatus for grinding heated plane of cooler according to claim 1, wherein the abrasive includes a grinding liquid and grinding particles, while the abrasive supply barrel has a nozzle.