INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF

  • US 20120319295A1
  • Filed: 06/17/2011
  • Published: 12/20/2012
  • Est. Priority Date: 06/17/2011
  • Status: Abandoned Application
First Claim
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1. A method of manufacture of an integrated circuit packaging system comprising:

  • forming a circuit structure having a circuit active side and a cavity from the circuit active side;

    mounting an integrated circuit device in the cavity;

    forming a base encapsulation, having a base first side facing away from the circuit active side, on the circuit active side, around the integrated circuit device, and in the cavity;

    forming a first conductive pin, having a first pin height, in the base encapsulation and traversing from the circuit active side to the base first side;

    forming a second conductive pin, having a second pin height equivalent to the first pin height, in the base encapsulation and traversing from the integrated circuit device to the base first side; and

    removing a portion of the circuit structure to form a circuit non-active side and expose the integrated circuit device and a base second side, the base second side opposite the base first side.

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