LIQUID PHASE SINTERED SILICON CARBIDE ABRASIVE PARTICLES
First Claim
Patent Images
1. An abrasive article comprising:
- a bonded abrasive body having abrasive particles contained within a bond material, the abrasive particles comprising silicon carbide and essentially free of carbon-based and boron-based sintering aid materials.
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Accused Products
Abstract
An abrasive article includes a bonded abrasive body having abrasive particles contained within a bond material. The abrasive particles include silicon carbide and are essentially free of carbon-based and boron-based sintering aid materials. In an embodiment, the bond material can include a phenolic resin. In another embodiment, the bonded abrasive body can include an oxide phase disposed interstitially between the silicon carbide abrasive particles. In an additional embodiment, the abrasive particles can consist essentially of silicon carbide and aluminum oxide in a ratio of silicon carbide to alumina of at least about 8:1.
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Citations
45 Claims
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1. An abrasive article comprising:
a bonded abrasive body having abrasive particles contained within a bond material, the abrasive particles comprising silicon carbide and essentially free of carbon-based and boron-based sintering aid materials. - View Dependent Claims (2, 3, 4, 5, 6, 14, 16, 17, 19, 21, 24, 29, 30, 31, 33)
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34. An abrasive article comprising:
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a bonded abrasive body having abrasive particles contained within a bond material, wherein the abrasive particles include liquid phase sintered silicon carbide; and wherein the body comprises a G-ratio of at least about 200 for grinding a workpiece comprising metal, at a constant infeed speed, for a depth of cut of at least about 0.0005 inches, wherein the G-ratio is a measure of weight of material removed from a workpiece to weight of material lost from the bonded abrasive body. - View Dependent Claims (37, 38)
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45. An abrasive article comprising:
a bonded abrasive body having abrasive particles contained within a bond material, the abrasive particle including silicon carbide grains and an oxide phase disposed interstitially between the grains of silicon carbide, wherein the bond material comprises a phenolic resin.
Specification