GATE DIELECTRIC OF SEMICONDUCTOR DEVICE
First Claim
1. A method for fabricating a semiconductor device, the method comprising:
- providing a semiconductor substrate having a first, second and third device region;
forming a first dielectric layer in the first region;
thereafter, forming a second dielectric layer in the second region;
forming a hard mask layer on the first device region on the first dielectric layer; and
forming a high-k dielectric layer on the first, second and third device regions, wherein the high-k dielectric layer is formed on the hard mask layer and the second dielectric layer.
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Abstract
A method of fabricating a semiconductor device having a different gate structure in each of a plurality of device regions is described. The method may include a replacement gate process. The method includes forming a hard mask layer on oxide layers formed on one or more regions of the substrate. A high-k gate dielectric layer is formed on each of the first, second and third device regions. The high-k gate dielectric layer may be formed directly on the hard mask layer in a first and second device regions and directly on an interfacial layer formed in a third device region. A semiconductor device including a plurality of devices (e.g., transistors) having different gate dielectrics formed on the same substrate is also described.
14 Citations
20 Claims
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1. A method for fabricating a semiconductor device, the method comprising:
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providing a semiconductor substrate having a first, second and third device region; forming a first dielectric layer in the first region; thereafter, forming a second dielectric layer in the second region; forming a hard mask layer on the first device region on the first dielectric layer; and forming a high-k dielectric layer on the first, second and third device regions, wherein the high-k dielectric layer is formed on the hard mask layer and the second dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of fabricating a semiconductor device, the method comprising:
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forming a first oxide layer on a first device region of a semiconductor substrate; forming a second oxide layer on a second device region of the semiconductor substrate, wherein the second oxide layer differs in thickness from the first oxide layer; forming a hard mask layer on the first oxide layer and the second oxide layer; forming a dummy gate electrode on the hard mask layer in each of the first and second device regions; forming a source or drain adjacent the dummy gate electrode in the first device region and a source or drain adjacent the dummy gate electrode in the second device region; thereafter, removing each of the dummy gate electrodes, wherein the first oxide layer and the second oxide layer remain disposed on the semiconductor substrate during the removal; forming an interfacial layer in a third device region of the semiconductor substrate; after removing the dummy gate electrodes, forming a high-k gate dielectric layer on each of the first, second and third device regions, wherein the high-k gate dielectric layer is formed directly on the hard mask layer in the first and second device regions and directly on the interfacial layer in the third device region; and forming a metal gate electrode on the high-k gate dielectric layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor device, comprising:
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a semiconductor substrate; a first gate structure formed on the semiconductor substrate, wherein the first gate structure includes a first oxide layer, a nitride layer on the oxide layer, and a high-k dielectric layer on the nitride layer; a second gate structure formed on the semiconductor device, wherein the second gate structure includes a second oxide layer, the nitride layer on the oxide layer, and the high-k dielectric layer disposed on the nitride layer; and a third gate structure formed on the semiconductor substrate, wherein the third gate structure includes an interfacial layer and the high-k dielectric layer disposed on the interfacial layer. - View Dependent Claims (18, 19, 20)
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Specification