ELECTRODE ARRAY ASSEMBLY AND METHOD OF MAKING SAME

• US 20130023972A1
• Filed: 09/14/2012
• Published: 01/24/2013
• Est. Priority Date: 01/11/2005
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Kuzma, Janusz A., Pianca, Anne M.
• Granted Patent: US 8,650,747 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/0553 Paddle shaped electrodes, e.g. for laminotomy
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts
• CPC Class Codes: Y10T 29/4922 with molding of insulation

Abstract

A lead assembly and a method of making a lead are provided. The method of making a multi-contact lead assembly comprises placing monofilament placed in the void spaces not occupied by the plurality of conductor wires and, in one embodiment, thermally fusing the monofilament to the like material spacer by applying heat just below the melting temperature of the monofilament and spacer material. Alternatively, the monofilament and spacer may be of different materials and heat is applied to cause at least one material to thermally reflow or melt. The conductive contacts may be located at either the distal end and/or proximal end of the lead. Oversized spacers may be used in order to provide extra material to fill voids during the thermal fusion/reflow process.

Claims

1. (canceled)

2. A stimulation lead assembly for making a lead, the assembly comprising:

a lead body defining a central lumen extending along the lead body and a plurality of conductor lumens disposed circumferentially around the central lumen and extending along the lead body;

a plurality of electrically conductive contacts disposed along an end of the lead body, wherein a portion of each of the conductor lumens is disposed beneath the conductive contacts;

a plurality of conductor wires disposed in the conductor lumens, wherein at least one of the conductor wires is connected to each conductive contact, wherein each conductor lumen comprises an occupied portion within which at least one of the conductor wires is disposed and an unoccupied portion in which none of the conductor wires is disposed, the unoccupied portion extending from an end of the conductor lumen; and

a solid, non-conductive material disposed, at least in part, beneath the conductive contacts and filling the unoccupied portion of at least one of the conductor lumens;

wherein the non-conductive material is thermally fused with the lead body from heat applied to the lead assembly, which heat is at a temperature to cause the non-conductive material to thermally reflow or melt.

3. The lead assembly of claim 2, further comprising a plurality of spacers disposed between adjacent pairs of the conductive contacts.

4. The lead assembly of claim 3, wherein the spacers and the non-conductive material are thermally fused together from heat applied to the lead assembly.

5. The lead assembly of claim 4, wherein a material of the spacers and the non-conductive material are a same material.

6. The lead assembly of claim 4, wherein a material of the spacers and the non-conductive material are different materials.

7. The lead assembly of claim 2, wherein the plurality of electrically conductive contacts are located on a proximal end of the stimulation lead.

8. The lead assembly of claim 2, wherein the plurality of electrically conductive contacts are located on a distal end of the stimulation lead.

9. The lead assembly of claim 2, wherein the non-conductive material is polyurethane.

10. The lead assembly of claim 2, wherein the plurality of conductor lumens is exactly eight conductor lumens.

11. The lead assembly of claim 2, wherein the non-conductive material fills the unoccupied portion of each of the conductor lumens.

12. A stimulation lead assembly for making a lead, the assembly comprising:

a lead body defining a central lumen extending along the lead body and a plurality of conductor lumens disposed circumferentially around the central lumen and extending along the lead body;

a plurality of electrically conductive contacts disposed along an end of the lead body, wherein a portion of each of the conductor lumens is disposed beneath the conductive contacts;

a plurality of conductor wires disposed in the conductor lumens, wherein at least one of the conductor wires is connected to each conductive contact; and

a solid, non-conductive material disposed, at least in part, beneath the conductive contacts within portions of the conductor lumens not occupied by conductor wire.

13. The lead assembly of claim 12, wherein the non-conductive material is thermally fused with the lead body from heat applied to the lead assembly, which heat is at a temperature to cause the non-conductive material to thermally reflow or melt.

14. The lead assembly of claim 12, further comprising a plurality of spacers disposed between adjacent pairs of the conductive contacts.

15. The lead assembly of claim 14, wherein the spacers and the non-conductive material are thermally fused together from heat applied to the lead assembly.

16. A stimulation lead assembly for making a lead, the assembly comprising:

a lead body defining a plurality of conductor lumens;

a plurality of electrically conductive contacts disposed along an end of the lead body;

a plurality of spacers disposed between pairs of adjacent conductive contacts;

a plurality of conductor wires disposed in the conductor lumens, wherein at least one of the conductor wires is connected to each conductive contact; and

a solid, non-conductive material disposed, at least in part, beneath the conductive contacts and within portions of the conductor lumens not occupied by conductor wire;

wherein the spacers and non-conductive material are thermally fused from heat applied to the lead assembly.

17. The lead assembly of claim 16, wherein a material of the spacers and the non-conductive material are a same material.

18. The lead assembly of claim 16, wherein a material of the spacers and the non-conductive material are different materials.

19. The lead assembly of claim 16, wherein the plurality of electrically conductive contacts are located, on a proximal end of the stimulation lead.

20. The lead assembly of claim 16, wherein the plurality of electrically conductive contacts are located on a distal end of the stimulation lead.

21. The lead assembly of claim 16, wherein the non-conductive material is thermally fused with the lead body.