ANTENNA SWITCH MODULES AND METHODS OF MAKING THE SAME

• US 20130037924A1
• Filed: 08/08/2012
• Published: 02/14/2013
• Est. Priority Date: 08/10/2011
• Status: Active Grant

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Lee, Jong-Hoon, Shih, Chuming
• Granted Patent: US 8,786,079 B2
• Time in Patent Office: Days
• US Class Current: 257/664
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 28/40 Capacitors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01P 11/001 Manufacturing waveguides or transmission lines of the waveguide type
• CPC Class Codes: H01Q 1/50 Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

Antenna switch modules and methods of making the same are provided. In certain implementations, an antenna switch module includes a package substrate, an integrated filter, and a silicon on insulator (SOI) die attached to the package substrate. The SOI die includes a capacitor configured to operate in the integrated filter and a multi throw switch for selecting amongst the RF signal paths. In some implementations, a surface mount inductor is attached to the package substrate adjacent the SOI die and is configured to operate in the integrated filter with the capacitor. In certain implementations, the inductor is formed from a conductive layer of the package substrate disposed beneath a layer of the package substrate used to attach the SOI die.

Claims

1. An antenna switch module comprising:

a package substrate implemented to receive one or more electrical components;

a silicon on insulator (SOI) die including a first capacitor and a switch configured to be coupled to a plurality of radio frequency (RF) signal paths, the SOI die attached to the package substrate; and

a first integrated filter configured to filter an RF signal received on a first RF signal path of the plurality of RF signal paths, the first integrated filter including the first capacitor of the SOI die and a first inductor.

2. The antenna switch module of claim 1 wherein the package substrate includes a plurality of conductive layers and a plurality of non-conductive layers.

3. The antenna switch module of claim 2 wherein the first inductor is formed at least partly from a first conductive layer of the plurality of conductive layers, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

4. The antenna switch module of claim 3 wherein the first inductor is a spiral inductor formed from trace of the first conductive layer.

5. The antenna switch module of claim 3 wherein the first inductor is formed from trace of more than one of the plurality of conductive layers.

6. The antenna switch module of claim 1 wherein the first inductor has an inductance ranging between about 2.5 nH and about 7 nH.

7. The antenna switch module of claim 1 wherein the first inductor is a surface mount component attached to the package substrate adjacent the SOI die.

8. The antenna switch module of claim 1 further comprising a second integrated filter configured to filter a RF signal received on a second RF signal path of the plurality of RF signal paths, the second integrated filter including a second capacitor of the SOI die and a second inductor.

9. The antenna switch module of claim 8 wherein the package substrate includes a plurality of conductive layers and a plurality of non-conductive layers, and the first and second inductors are formed at least partly from a first conductive layer of the plurality of conductive layers, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

10. The antenna switch module of claim 9 wherein the first and second inductors are separated by a column of vias in the package substrate.

12. The antenna switch module of claim 8 wherein the first and second inductors include first and second surface mount inductors, respectively, the first and second surface mount inductors attached to the package substrate.

13. The antenna switch module of claim 1 wherein the first capacitor has a capacitance ranging between about 0.8 pF and about 2.7 pF.

14. The antenna switch module of claim 1 wherein the SOI die is electrically connected to the package substrate using bond wires.

15. The antenna switch module of claim 1 wherein the SOI die is a flip-chip die that is electrically connected to the package substrate using solder bumps.

16. The antenna switch module of claim 1 wherein the first inductor and first capacitor are electrically connected in series.

17. The antenna switch module of claim 1 wherein the switch is a single pole multi-throw switch.

11. The antenna switch module of 8 claim wherein the first inductor includes a surface mount inductor attached to the package substrate adjacent the SOI die and the second inductor is formed at least partly from a first conductive layer of a plurality of conductive layers of the package substrate, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

18. An antenna switch module comprising:

a package substrate implemented to receive one or more electrical components;

a silicon on insulator (SOI) die including a capacitor and a switch configured to be coupled to a plurality of radio frequency (RF) signal paths, the SOI die attached to the package substrate; and

a means for filtering an RF signal received on a first RF signal path of the plurality of RF signal paths, the filtering means including the capacitor of the SOI die and an inductor associated with the package substrate.

19. The antenna switch module of claim 18 wherein the package substrate includes a plurality of conductive layers and a plurality of non-conductive layers.

20. The antenna switch module of claim 19 wherein the inductor is formed at least partly from a first conductive layer of the plurality of conductive layers, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

21. The antenna switch module of claim 18 wherein the inductor is a surface mount component attached to the package substrate adjacent the SOI die.

22. A method of making an antenna switch module, the method comprising:

providing a package substrate implemented to receive one or more electrical components;

attaching a silicon on insulator (SOI) die to the package substrate, the SOI die including a capacitor and a switch configured to be coupled to a plurality of radio frequency (RF) signal paths; and

providing an integrated filter for filtering an RF signal received on a first RF signal path of the plurality of RF signal paths, the integrated filter including the capacitor of the SOI die and an inductor.

23. The method of claim 22 further comprising forming the inductor at least partly from a first conductive layer of a plurality of conductive layers of the package substrate, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

24. The method of claim 22 wherein the inductor is a surface mount component, the method further comprising attaching the inductor to the package substrate adjacent the SOI die.

25. A wireless device comprising:

an antenna switch module including a package substrate, a silicon on insulator (SOI) die and an integrated filter, the SOI die including a capacitor and a switch electrically connected to a plurality of radio frequency (RF) signal paths, the SOI die attached to the package substrate, the integrated filter including the capacitor of the SOI die and an inductor, the integrated filter configured to filter an RF signal received on a first RF signal path of the plurality of RF signal paths.

26. The wireless device of claim 25 wherein the package substrate includes a plurality of conductive layers and a plurality of non-conductive layers.

27. The wireless device of claim 26 wherein the inductor is formed at least partly from a first conductive layer of the plurality of conductive layers, the first conductive layer disposed beneath a layer of the package substrate used to attach the SOI die.

28. The wireless device of claim 25 wherein the inductor is a surface mount component attached to the package substrate adjacent the SOI die.

29. The wireless device of claim 25 further comprising an antenna electrically connected to the antenna switch module.

30. The wireless device of claim 25 further comprising a transceiver electrically connected to the antenna switch module.

31. The wireless device of claim 25 further comprising a Wi-Fi module electrically connected to the antenna switch module.

32. The wireless device of claim 25 further comprising a mobile television module electrically connected to the antenna switch module.

33. The wireless device of claim 25 further comprising a front-end module electrically connected to the antenna switch module.

34. The wireless device of claim 25 further comprising a power amplifier module electrically connected to the antenna switch module.