ROGOWSKI COIL ASSEMBLIES AND METHODS FOR PROVIDING THE SAME

• US 20130043967A1
• Filed: 08/18/2011
• Published: 02/21/2013
• Est. Priority Date: 08/18/2011
• Status: Active Grant

• Current Assignee: Aclara Meters LLC (Hubbell, Inc.)
• Original Assignee: General Electric Company
• Inventors: Rouaud, Didier Gilbert, Chamarti, Subramanyam Satyasurya
• Granted Patent: US 8,872,611 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: G01R 15/181 using coils without a magnetic core, e.g. Rogowski coils
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Rogowski coil assemblies and methods for providing or forming Rogowski coil assemblies are provided. A Rogowski coil assembly may include a printed circuit board and a plurality of Rogowski coil sections mounted to an external surface of the printed circuit board by one or more respective circuit traces. The circuit traces may retain and connect the plurality of Rogowski coil sections.

Claims

1. A Rogowski coil assembly, comprising:

a printed circuit board; and

a plurality of Rogowski coil sections mounted to an external surface of the printed circuit board by one or more respective circuit traces,

wherein the circuit traces retain and connect the plurality of Rogowski coil sections.

2. The Rogowski coil assembly of claim 1, wherein the printed circuit board comprises an opening configured to receive at least one conductor that is monitored by the plurality of Rogowski coil sections.

3. The Rogowski coil assembly of claim 2, wherein each of the plurality of Rogowski coil sections is positioned an approximately equal distance from the opening.

4. The Rogowski coil assembly of claim 2, wherein the plurality of Rogowski coil sections are positioned around the opening.

5. The Rogowski coil assembly of claim 2, further comprising:

a capacitive shielding positioned within the opening between the printed circuit board and the at least one conductor.

6. The Rogowski coil assembly of claim 2, further comprising:

a slot in the printed circuit board between the opening and an edge of the printed circuit board.

7. The Rogowski coil assembly of claim 1, further comprising:

at least one connector attached to the printed circuit board and configured to provide measurements data collected by the plurality of Rogowski coil sections to an external measurements processing circuit.

8. The Rogowski coil assembly of claim 1, further comprising:

a measurements processing circuit attached to the printed circuit board and configured to receive measurements data collected by the plurality of Rogowski coil sections and process the received measurements data.

9. The Rogowski coil assembly of claim 1, wherein the plurality of Rogowski coil sections comprise approximately three to approximately twelve Rogowski coil sections.

10. The Rogowski coil assembly of claim 1, wherein a return current path for the plurality of Rogowski coil sections comprises one of (i) a circuit trace on the printed circuit board or (ii) a conductor that passes through the plurality of Rogowski coil sections.

11. A method for providing a Rogowski coil assembly, the method comprising:

providing a printed circuit board; and

mounting a plurality of Rogowski coil sections to an external surface of the printed circuit board by one or more respective circuit traces,

wherein the circuit traces retain and connect the plurality of Rogowski coil sections.

12. The method of claim 11, further comprising:

providing an opening in the printed circuit board, ‘

the opening configured to receive at least one conductor that is monitored by the plurality of Rogowski coil sections.

13. The method of claim 12, further comprising:

positioning each of the plurality of Rogowski coil sections an approximately equal distance from the opening.

14. The method of claim 12, further comprising:

positioning the plurality of Rogowski coil sections around the opening.

15. The method of claim 12, further comprising:

providing a capacitive shielding within the opening between the printed circuit board and the at least one conductor.

16. The method of claim 12, further comprising:

forming a slot in the printed circuit board between the opening and an edge of the printed circuit board.

17. The method of claim 11, further comprising:

attaching at least one connector to the printed circuit board, the at least one connector configured to provide measurements data collected by the plurality of Rogowski coil sections to an external measurements processing circuit.

18. The method of claim 11, further comprising:

attaching a measurements processing circuit to the printed circuit board, the measurements processing circuit configured to receive measurements data collected by the plurality of Rogowski coil sections and process the received measurements data.

19. The method of claim 11, wherein mounting a plurality of Rogowski coil sections comprises mounting approximately three to approximately twelve Rogowski coil sections.

20. The method of claim 11, further comprising:

providing a return current path for the plurality of Rogowski coil sections, the return current path comprising one of (i) a circuit trace on the printed circuit board or (ii) a conductor that passesthrough the plurality of Rogowski coil sections.