Method for Manufacture of Multi-Layer Wire Structure for High Efficiency Wireless Communication
First Claim
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1. A method of manufacturing a wire structure, the method comprising:
- forming a plurality of conductors, each conductor having a conductor length, a conductor height, a conductor depth and a conductor surface having a skin depth; and
forming a plurality of insulators, each insulator positioned between each of the plurality of conductors such that the wire structure is capable of prorogating an electrical signal through the skin depth of the conductor surface.
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Abstract
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
60 Citations
18 Claims
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1. A method of manufacturing a wire structure, the method comprising:
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forming a plurality of conductors, each conductor having a conductor length, a conductor height, a conductor depth and a conductor surface having a skin depth; and forming a plurality of insulators, each insulator positioned between each of the plurality of conductors such that the wire structure is capable of prorogating an electrical signal through the skin depth of the conductor surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification