Multi-Layer Wire Structure for High Efficiency Wireless Communication

• US 20130068507A1
• Filed: 09/15/2011
• Published: 03/21/2013
• Est. Priority Date: 03/09/2009
• Status: Active Grant

• Current Assignee: Nucurrent, Inc.
• Original Assignee: Nucurrent, Inc.
• Inventors: Singh, Vinit, Frysz, Christine A.
• Granted Patent: US 9,439,287 B2
• Time in Patent Office: Days
• US Class Current: 174/251
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Claims

1. A structure comprising:

a plurality of conductor layers;

an insulator layer separating each of the conductor layers; and

wherein an electrical resistance is reducible when an electrical signal is propagated through the conductor layers at a frequency.

2. The structure of claim 1 wherein the conductor layer comprises at least one of a conductive tape, a conductive ribbon, and a deposited metal.

3. The structure of claim 1 wherein at least one connector connects two or more of the conductor layers.

4. The structure of claim 3 wherein the connector comprises at least one of a via, a solder, a tab, a wire, a pin, and a rivet.

5. The structure of claim 1 wherein the frequency is selected from a frequency range between about 100 kHz to about 3 MHz.

6. The structure of claim 1 wherein the frequency is selected from a frequency range between about 3 MHz to about 10 GHz.

7. The structure of claim 5 wherein the frequency is in a frequency band that is within the range of about 100 kHz to about 3 MHz.

8. The structure of claim 5 wherein the frequency is in a frequency band that is within the range of about 3 MHz to about 10 GHz.

9. The structure of claim 1 wherein each of the plurality of conductor layers is in a parallel orientation.

10. The structure of claim 1 wherein the plurality of conductor layers are connected electrically in parallel.

11. The structure of claim 10 wherein the plurality of conductive layers connected electrically in parallel are connected electrically in series with second plurality of conductive layers connected electrically in parallel.

12. The structure of claim 1 wherein the electrical signal comprises at least one of an energy signal, a power signal, and a data signal.

13. The structure of claim 1 wherein the electrical signal comprises at least one of an electrical current, an electrical voltage, and a digital data signal.

14. The structure of claim 1 wherein the structure has a quality factor greater than 100.

15. The structure of claim 1 having a cross-sectional shape comprising at least one of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, and an elliptical cross-section.

16. The structure of claim 1 having a structural shape comprising at least one of a circular solenoidal configuration, a square solenoidal configuration, a circular spiral configuration, a square spiral configuration, a rectangular configuration, a triangular configuration, a circular spiral-solenoidal configuration, a square spiral-solenoidal configuration, and a conformal solenoid configuration.

17. The structure of claim 1 wherein the plurality of conductor layers has at least one turn.

18. The structure of claim 1 wherein at least one conductor layer is formed from an electrically conductive material.

20. The structure of claim 1 wherein the at least one insulator layer is formed from an electrically insulative material.

21. The structure of claim 20 wherein the electrically insulative material comprises at least one of air, Styrofoam, silicon dioxide, a suitable biocompatible ceramic or any similar dielectric with a low permittivity, a non-conductive dielectric with a high permittivity, and a ferrite material.

22. The structure of claim 1 further incorporatable within a device comprising at least one of a resonator, an antenna, an RFID tag, an RFID transponder, and a medical device.

19. The structure of claim 19 wherein the electrically conductive material comprises at least one of copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hathium, nitinol, Co—

Cr—

Ni alloys, stainless steel, gold, a gold alloy, palladium, carbon, silver, a noble metal, and a biocompatible material.

23. A wire structure comprising:

a plurality of conductors, each conductor having a conductor length, a conductor height, a conductor depth and a conductor surface having a skin depth; and

a plurality of insulators positioned between each of the plurality of conductors such that each of the insulators is positioned between adjacent conductors of the plurality of conductors;

wherein the wire structure is formed to be capable of propagating an electrical signal through the skin depth of the conductor surface.

24. The wire structure of claim 23 wherein the plurality of conductors comprises a first conductor layer and a second conductor layer separated by an insulator layer therebetween wherein the first conductor layer is connected to the second conductor layer by at least one connector.

25. The wire structure of claim 24 wherein at least one of the first and second conductor layers comprises at least one a conductive tape, a conductive ribbon, and a deposited metal.

26. The structure of claim 24 wherein the connector comprises at least one of a via, a solder, a tab, a wire, a pin, and a rivet.

27. The wire structure of claim 23 wherein the conductor has a cross-sectional shape comprising at least one of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, and an elliptical cross-section.

28. The wire structure of claim 23 wherein the electrical signal comprises at least one of an energy signal, a power signal, and a data signal.

29. The wire structure of claim 23 wherein the electrical signal is at least one of an electrical current, an electrical voltage, and a digital data signal.

30. The wire structure of claim 23 wherein the skin depth ranges from approximately one-half of the conductor depth to about equal to the conductor depth.

31. The wire structure of claim 23 wherein the conductor depth ranges from skin depth to about twice the skin depth.

32. The wire structure of claim 23 wherein the conductor depth is greater than about twice the skin depth.

33. The wire structure of claim 23 wherein the plurality of conductor layers has at least one turn.

34. The wire structure of claim 23 wherein each of the plurality of conductor layers has substantially the same conductor length, conductor height, or conductor depth.

35. The wire structure of claim 23 wherein the wire structure has a quality factor greater than 100.

36. The wire structure of claim 23 having a structural shape comprising at least one a circular solenoidal configuration, a square solenoidal configuration, a circular spiral configuration, a square spiral configuration, a rectangular configuration, a triangular configuration, a circular spiral-solenoidal configuration, a square spiral-solenoidal configuration, and a conformal solenoid configuration.

37. The wire structure of claim 23 wherein the at least one conductor is formed from an electrically conductive material.

38. The wire structure of claim 37 wherein the electrically conductive material comprises at least one of copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hathium, nitinol, Co—

Cr—

Ni alloys, stainless steel, gold, a gold alloy, palladium, carbon, silver, a noble metal, and a biocompatible material.

39. The wire structure of claim 23 wherein the at least one insulator is formed from an electrically insulative material.

40. The wire structure of claim 39 wherein the electrically insulative material comprises at least one of air, Styrofoam, silicon dioxide, a suitable biocompatible ceramic or any similar dielectric with a low permittivity, a non-conductive dielectric with a high permittivity, and a ferrite material.

41. The wire structure of claim 23 wherein the electrical signal is inducible through the structure at least one frequency.

42. The wire structure of claim 41 wherein the frequency is selected from a frequency range from about 100 kHz to about 3 MHz.

43. The wire structure of claim 41 wherein the frequency is selected from a frequency range from about 3 MHz to about 10 GHz.

44. The wire structure of claim 42 wherein the frequency is a frequency band that is within the range of about 100 kHz to about 3 MHz.

45. The wire structure of claim 43 wherein the frequency is a frequency band that is within the range of about 1 MHz to about 10 GHz.

46. The wire structure of claim 23 further comprising a circuit element selected from a group consisting of a resistor, an inductor, and a capacitor.

47. The wire structure of claim 23 further incorporatable within a device comprising at least one of a resonator, an antenna, an RFID tag, an RFID transponder and a medical device.