Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Communication

• US 20130069748A1
• Filed: 09/15/2011
• Published: 03/21/2013
• Est. Priority Date: 03/09/2009
• Status: Active Grant

• Current Assignee: Nucurrent, Inc.
• Original Assignee: Nucurrent, Inc.
• Inventors: Singh, Vinit, Frysz, Christine A.
• Granted Patent: US 9,208,942 B2
• Time in Patent Office: Days
• US Class Current: 336/115
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H04B 5/24 Inductive coupling
• CPC Class Codes: H05K 1/165 incorporating printed inductors

Abstract

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Claims

1. A structure for wireless communication comprising:

a plurality of conductor layers;

an insulator layer separating each of the conductor layers; and

,

at least one connector connecting two or more of the conductor layers;

wherein an electrical resistance is reducible when an electrical signal is induced within the structure at a frequency.

2. The structure of claim 1 wherein the conductor layer comprises at least one of a conductive tape, a conductive ribbon, and a deposited metal.

3. The structure of claim 1 wherein the frequency is selected from a frequency range from about 100 kHz to about 3 MHz.

4. The structure of claim 3 wherein the frequency is a frequency band that is within the range of about 100 kHz to about 3 MHz.

5. The structure of claim 1 wherein the frequency is selected from a frequency range from about 3 MHz to about 10 GHz.

6. The structure of claim 5 wherein the frequency is a frequency band that is within the range of about 3 MHz to about 10 GHz.

7. The structure of claim 1 wherein each of the plurality of conductor layers is in a parallel orientation.

8. The structure of claim 1 wherein the number of the plurality of conductor layers is less than or equal to the total number of layers and are connected electrically in parallel.

9. The structure of claim 8 wherein the plurality of conductor layers connected electrically in parallel is connected electrically in series with one or more of a second plurality of conductor layers connected electrically in parallel.

10. The structure of claim 1 wherein the electrical signal comprises at least one of an energy signal, a power signal, and a data signal.

11. The structure of claim 1 wherein the electrical signal is at least one of an electrical current, an electrical voltage, or a digital data signal.

12. The structure of claim 1 having a quality factor greater than 100.

13. The structure of claim 1 further comprising a circuit element selected from the group consisting of a resistor, an inductor, and a capacitor.

14. The structure of claim 1 wherein the conductor layer has a cross-sectional shape wherein the cross-sectional shape is at least one of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, and an elliptical cross-section.

15. The structure of claim 1 wherein the connector comprises at least one of a via, a solder, a tab, a wire, a pin, a rivet, and the like.

16. The structure of claim 1 having a structural shape wherein the structural shape comprises at least one of a circular solenoidal configuration, a square solenoidal configuration, a circular spiral configuration, a square spiral configuration, a rectangular configuration, a triangular configuration, a circular spiral-solenoidal configuration, a square spiral-solenoidal configuration, and a conformal solenoid configuration.

17. The structure of claim 1 wherein the plurality of conductor layers has at least one turn.

18. The structure of claim 1 wherein at least one conductor layer is formed from an electrically conductive material.

19. The structure of claim 18 wherein the electrically conductive material comprises at least one of copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hathium, nitinol, Co—

Cr—

Ni alloys, stainless steel, gold, a gold alloy, palladium, carbon, silver, a noble metal, and a biocompatible material.

20. The structure of claim 1 wherein at least one insulator layer is formed from an electrically insulative material.

21. The structure of claim 20 wherein the electrically insulative material comprises at least one of air, Styrofoam, silicon dioxide, a suitable biocompatible ceramic or any similar dielectric with a low permittivity, a non-conductive dielectric with a high permittivity, and a ferrite material.

22. The structure of claim 1 further incorporatable within a device comprising at least one of a resonator, an antenna, an RFID tag, an RFID transponder, and a medical device.

23. A resonator for wireless communication comprising:

a plurality of conductors, each conductor having a conductor length, a conductor height, a conductor depth, and a conductive surface having a skin depth wherein the plurality of conductors are arranged to form a resonator body having a resonator body length, a resonator body width and a resonator body depth wherein an electrical signal is inducible through the resonator body and the electrical signal is propagatable through the conducting surface of the skin depth.

24. The resonator of claim 23 wherein at least one of the plurality of conductor layers comprises at least one of a conductive tape, a conductive ribbon, and a deposited metal.

25. The resonator of claim 23 wherein the plurality of conductors comprises a first conductor layer and a second conductor layer and the first conductor layer and second conduction layer are separated by an insulator layer wherein the first conductor layer is connected to the second conductor layer by at least one connector.

26. The resonator of claim 23 wherein the conductor has a cross-sectional shape comprising at least one of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, and an elliptical cross-section.

27. The resonator of claim 23 wherein the electrical signal comprises at least one of an energy signal, a power signal, and a data signal.

28. The resonator of claim 23 wherein the electrical signal is at least one of an electrical current, an electrical voltage, and a digital data signal.

29. The resonator of claim 23 wherein the skin depth ranges from approximately one-half of the conductor depth to about equal to the conductor depth.

30. The resonator of claim 23 wherein the conductor depth ranges from skin depth to about twice the skin depth.

31. The resonator of claim 23 wherein the conductor depth is greater than about twice times the skin depth.

32. The resonator of claim 23 wherein the plurality of conductor layers has at least one turn.

33. The resonator of claim 23 wherein each of the plurality of conductor layers has substantially the same conductor length, conductor height, and conductor depth.

34. The resonator of claim 23 wherein the resonator has a quality factor greater than 100.

35. The resonator of claim 23 having a structural shape comprising at least one of a circular solenoidal configuration, a square solenoidal configuration, a circular spiral configuration, a square spiral configuration, a rectangular configuration, a triangular configuration, a circular spiral-solenoidal configuration, a square spiral-solenoidal configuration, and a conformal solenoid configuration.

36. The resonator of claim 23 wherein at least one conductor layer is formed from an electrically conductive material.

37. The resonator of claim 36 wherein the electrically conductive material comprises at least one of copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hathium, nitinol, Co—

Cr—

Ni alloys, stainless steel, gold, a gold alloy, palladium, carbon, silver, a noble metal, and a biocompatible material.

38. The resonator of claim 23 wherein at least one insulator layer is formed from an electrically insulative material.

39. The resonator of claim 38 wherein the electrically insulative material comprises at least one of air, Styrofoam, silicon dioxide, a suitable biocompatible ceramic or any similar dielectric with a low permittivity, a non-conductive dielectric with a high permittivity, and a ferrite material.

40. The resonator of claim 23 wherein the electrical signal is inducible through the resonator body using at least one frequency.

41. The resonator of claim 40 wherein the frequency is selected from a frequency range from about 100 kHz to about 3 MHz.

42. The resonator of claim 41 wherein the frequency is a frequency band that is within the range of about 100 kHz to about 3 MHz.

43. The resonator of claim 40 wherein the frequency is selected from a frequency range from 110 about 3 MHz to about 10 GHz.

44. The resonator of claim 43 wherein the frequency is a frequency band that is within the range of about 3 MHz to about 10 GHz.

45. The resonator of claim 23 further comprising a circuit element selected from the group consisting of a resistor, an inductor, and a capacitor.

46. The resonator of claim 23 further incorporatable within a device comprising at least one of a resonator, an antenna, an RFID tag, an RFID transponder, and a medical device.