MITIGATION OF BLOCK BENDING IN A RING LASER GYROSCOPE CAUSED BY THERMAL EXPANSION OR COMPRESSION OF A CIRCUIT BOARD
First Claim
Patent Images
1. An apparatus comprising:
- a sheet of circuit board material;
at least one electrically conductive trace positioned on the sheet of circuit board material;
at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace; and
at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
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Accused Products
Abstract
An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
2 Citations
20 Claims
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1. An apparatus comprising:
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a sheet of circuit board material; at least one electrically conductive trace positioned on the sheet of circuit board material; at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace; and at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An apparatus comprising:
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an object having a top surface and a first coefficient of thermal expansion; a circuit board having a bottom surface and a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion of the object; adhesive material bonding the bottom surface of the circuit board to the top surface of the object, wherein the adhesive material is configured to inhibit the transfer of stresses generated in the sheet of material. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method comprising:
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fabricating a sheet of circuit board material with at least one deformation point between a first section and a second section of the sheet of circuit board material; fabricating at least one electrically conductive trace on the sheet of circuit board material; fabricating at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace; and wherein the at least one deformation point absorbs stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression. - View Dependent Claims (18)
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19. An apparatus comprising:
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a circuit board having a bottom surface and at least one dampening point between a first section and a second section of the sheet of circuit board; an object having a top surface; adhesive material attaching the bottom surface of the circuit board to the top surface of the object; wherein the at least one deformation point absorbs stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression; and wherein the adhesive material inhibits transfer of stresses from the circuit board to the object. - View Dependent Claims (20)
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Specification