LIQUID CRYSTAL DISPLAY MODULE AND A LIQUID CRYSTAL DISPLAY PANEL

• US 20130093990A1
• Filed: 10/27/2011
• Published: 04/18/2013
• Est. Priority Date: 10/12/2011
• Status: Abandoned Application

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Chen, Cheng-Hung, Chen, Shyhfeng, Wang, Jinjie
• Application Number:
  US13/376,605
• Publication Number:
  US 20130093990A1
• Time in Patent Office: Days
• US Class Current: 349/150
• CPC Class Codes: G02F 1/13458 Terminal pads
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2201/09918 Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/363 by soldering

Abstract

A liquid crystal display module is provided, which includes a display panel. The display panel disposes a plurality of panel solder pads. Two ends of each panel solder pad both dispose a wire longitudinally extending. The length of each panel solder pad longitudinally extends along a wire direction. The module further includes a FPC board, which has a plurality of FPC board solder pads. The FPC board solder pads and the panel solder pads are soldered together in a one-to-one corresponding relational manner after being aligned with each other by a machine. Two adjacent panel solder pads are stagger arranged along the wire direction. A distance between one panel solder pad and the corresponding wire of the other panel solder pad along the direction perpendicular to the wire is greater than a minimum of an alignment precision of the machine. A liquid crystal display panel is also provided.

Claims

1. A liquid crystal display module, comprising a display panel, the display panel disposing a plurality of panel solder pads, two ends of each of which both dispose a wire longitudinally extending, wherein the length of each panel solder pad longitudinally extending along a wire direction;

the liquid crystal display module further comprising a FPC board, the FPC board including a plurality of FPC board solder pads, the FPC board solder pads and the panel solder pads being soldered together in a one-to-one corresponding relational manner after being aligned with each other by a machine;

characterized in that;

two of the panel solder pads orderly arranged in a direction perpendicular to the wire direction being stagger arranged along the wire direction, and a distance between one panel solder pad and the corresponding wire of the other panel solder pad along the direction perpendicular to the wire being greater than a minimum of an alignment precision of the machine;

at least two of the panel solder pads orderly arranged in the direction perpendicular to the wire direction and the wires located on the at least two of panel solder pads constituting one solder group, so that forming multiple solder groups orderly arranged along the direction perpendicular to the wire direction; and

the display panel disposing an alignment mark, which can make the panel solder pads be aligned with the corresponding FPC board solder pad.

2. The liquid crystal display module as claimed in claim 1, characterized in that:

the widths of all panel solder pads on the display panel are the same, the widths of all FPC solder pads are the same, and the widths of the panel solder pads and the FPC solder pads are also the same.

3. The liquid crystal display module as claimed in claim 1, characterized in that:

the panel solder pads are connected to the FPC board solder pads by a conductive adhesive.

4. A liquid crystal display module, comprising a display panel, the display panel disposing a plurality of panel solder pads, two ends of each of which both dispose a wire longitudinally extending, wherein the length of each panel solder pad longitudinally extending along a wire direction;

the liquid crystal display module further comprising a FPC board, the FPC board including a plurality of FPC board solder pads, the FPC board solder pads and the panel solder pads being soldered together in a one-to-one corresponding relational manner after being aligned with each other by a machine;

characterized in that;

two of the panel solder pads orderly arranged in a direction perpendicular to the wire direction being stagger arranged along the wire direction, and a distance between one panel solder pad and the corresponding wire of the other panel solder pad along the direction perpendicular to the wire being greater than a minimum of an alignment precision of the machine.

5. The liquid crystal display module as claimed in claim 4, characterized in that:

at least two of the panel solder pads orderly arranged in the direction perpendicular to the wire direction and the wires located on the at least two of panel solder pads constitute one solder group, so that forming multiple solder groups orderly arranged along the direction perpendicular to the wire direction; and

in each solder group, the at least two of the panel solder pads orderly arranged in the direction perpendicular to the wire direction are stagger arranged along the wire direction.

6. The liquid crystal display module as claimed in claim 4, characterized in that:

the display panel disposes an alignment mark, which can make the panel solder pads be aligned with the corresponding FPC board solder pad.

7. The liquid crystal display module as claimed in claim 4, characterized in that:

the widths of all panel solder pads on the display panel are the same, the widths of all FPC solder pads are the same, and the widths of the panel solder pads and the FPC solder pads are also the same.

8. The liquid crystal display module as claimed in claim 4, characterized in that:

the panel solder pads are connected to the FPC board solder pads by a conductive adhesive.

9. A liquid crystal display panel, comprising a plurality of panel solder pads, two ends of each panel solder pad disposing a wire longitudinally extending, the length of each panel solder pad longitudinally extending along a wire direction;

characterized in that;

two of the panel solder pads orderly arranged in a direction perpendicular to the wire direction being stagger arranged along the wire direction, and a distance between one panel solder pad and the corresponding wire of the other panel solder pad along the direction perpendicular to the wire being greater than a minimum of an alignment precision of the machine.

10. The liquid crystal display panel as claimed in claim 9, characterized in that:

at least two of the panel solder pads orderly arranged in the direction perpendicular to the wire direction and the wires located on the at least two of panel solder pads constitute one solder group, so that forming multiple solder groups orderly arranged along the direction perpendicular to the wire direction; and

in each solder group, the at least two of the panel solder pads orderly arranged in the direction perpendicular to the wire direction are stagger arranged along the wire direction.

11. The liquid crystal display panel as claimed in claim 9, characterized in that:

the display panel disposes an alignment mark, which can make the panel solder pads be aligned with FPC board solder pads located on a FPC board.

12. The liquid crystal display panel as claimed in claim 11, characterized in that:

the widths of all panel solder pads on the display panel are the same, the widths of all FPC solder pads are the same, and the widths of the panel solder pads and the FPC solder pads are also the same.

13. The liquid crystal display panel as claimed in claim 11, characterized in that:

the panel solder pads are connected to the FPC board solder pads by a conductive adhesive.