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HOUSING ASSEMBLY TO ENCLOSE AND GROUND AN ELECTRICAL SUBASSEMBLY

  • US 20130135797A1
  • Filed: 11/30/2011
  • Published: 05/30/2013
  • Est. Priority Date: 11/30/2011
  • Status: Active Grant
First Claim
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1. A housing assembly to enclose and ground an electrical subassembly comprising:

  • a housing formed from a conductive polymer, the housing having a cavity sized to receive an electronic sub-assembly therein;

    a conductive boss insert-molded into the housing in conductive contact with the housing; and

    a conductive bracket fastened to the boss in conductive connection with the boss and the housing to support and electrically ground the housing.

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