LIGHT EMITTER PACKAGES AND DEVICES HAVING IMPROVED WIRE BONDING AND RELATED METHODS
First Claim
Patent Images
1. A light emitter package, comprising:
- a substrate;
at least one light emitting diode (LED) chip attached to the substrate; and
a wire bond electrically connected to the LED chip for electrically connecting to an electrical element, the wire bond resulting from wire bonding to the LED chip at a temperature of approximately 150°
C. or less.
3 Assignments
0 Petitions
Accused Products
Abstract
Light emitter packages and devices having improved wire bonding and related methods are disclosed. In one embodiment a light emitter package can include at least one light emitting diode (LED) chip electrically connected to an electrical element via a wire bond. The wire bond can be provided at improved wire bonding parameters such as a temperature of approximately 150° C. or less, a bonding time of approximately 100 ms or less, a power of approximately 1700 mW or less, and a force of approximately 100 grams force (gf) or less, or combinations thereof.
14 Citations
63 Claims
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1. A light emitter package, comprising:
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a substrate; at least one light emitting diode (LED) chip attached to the substrate; and a wire bond electrically connected to the LED chip for electrically connecting to an electrical element, the wire bond resulting from wire bonding to the LED chip at a temperature of approximately 150°
C. or less. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A light emitter package, comprising:
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a substrate; at least one light emitting diode (LED) chip bonded to the substrate via a silicone epoxy; and an electrical element; wherein the at least one LED chip is electrically connected to the electrical element via a wire bond provided at a temperature approximately equal to or less than a glass transition temperature of the silicone epoxy. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A light emitter package, comprising:
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at least one light emitting diode (LED) chip; and an electrical element; wherein the at least one LED chip is electrically connected to the electrical element via a wire bond provided at a plurality of the following improved parameters or combinations thereof; (i) a temperature of approximately 150°
C. or less;(ii) a bonding time of approximately 100 ms or less; (iii) a power of approximately 1700 mW or less; and (iv) a force of approximately 100 grams force (gf) or less. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33)
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34. A method of providing a light emitter package, the method comprising:
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providing at least one light emitting diode (LED) chip; providing an electrical element; and wire bonding the at least one LED chip to the electrical element at a temperature of approximately 150°
C. or less. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42)
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43. A method of providing a light emitter package, the method comprising:
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providing a substrate; providing at least one light emitting diode (LED) chip; and bonding the at least one LED chip to the substrate using a silicone epoxy; providing an electrical element; wire bonding the LED chip to the electrical element at a temperature approximately equal to or less than a glass transition temperature of the silicone epoxy. - View Dependent Claims (44, 45, 46, 47, 48, 49, 50, 51, 52, 53)
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54. A method of providing a light emitter package, the method comprising:
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providing at least one light emitting diode (LED) chip; providing an electrical element; wire bonding the LED chip to the electrical element using a plurality of four predetermined parameters or a combination thereof, the parameters comprising; a temperature of approximately 150°
C. or less;(ii) a bonding time of approximately 100 ms or less; (iii) a power of approximately 1700 mW or less; and (iv) a force of approximately 100 grams force (gf) or less. - View Dependent Claims (55, 56, 57, 58, 59)
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60. A light emitter package, comprising:
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a substrate; and at least one light emitting diode (LED) chip attached to the substrate; wherein the thermal resistance of the package comprises approximately 220 °
C./W or less. - View Dependent Claims (61, 62, 63)
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Specification