CERAMIC-BASED LIGHT EMITTING DIODE (LED) DEVICES, COMPONENTS, AND METHODS

• US 20130200420A1
• Filed: 03/15/2013
• Published: 08/08/2013
• Est. Priority Date: 02/07/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P.
• Granted Patent: US 9,806,246 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A light emitter device component containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, can include a body that can be ceramic and have a top surface, one or more light emitting devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitting devices. At least a portion of the top surface of the body to which the light emitting devices are mounted can be modified to have a reduced porosity compared to an as-fired ceramic body. Such components can result in improved adhesion strength and thermal management of the light emitting devices.

Claims

1. A light emitter device component comprising:

a body having a non-metallic top surface, at least a portion of the top surface having a reduced porosity compared to an as-fired ceramic body;

one or more light emitter devices mounted on the portion of the top surface; and

one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices.

2. The light emitter device component according to claim 1, wherein the body comprises a ceramic material.

3. The light emitter device component according to claim 2, wherein the body comprises a thick-film ceramic substrate.

4. The light emitter device component according to claim 2, wherein the body comprises a thin-film ceramic substrate.

5. The light emitter device component according to claim 1, wherein the portion of the top surface has a reduced porosity, and a remainder of the top surface has an unmodified porosity.

6. The light emitter device component according to claim 5, wherein the portion of the top surface has a porosity that is approximately equal to or less than approximately half of a porosity of the remainder of the top surface.

7. The light emitter device component according to claim 1, wherein substantially all of the top surface has a reduced porosity compared to an as-fired ceramic body.

8. The light emitter device component according to claim 1, wherein the at least a portion of the top surface has an open porosity of between approximately 0% and 15%.

9. The light emitter device component according to claim 1, wherein the portion of the top surface has been modified by lapping, polishing, and/or another mechanical modification.

10. The light emitter device component according to claim 1, wherein the portion of the top surface has been modified by a coating applied to the top surface.

11. The light emitter device component according to claim 9, wherein the coating is selected from the group consisting of silicone, epoxy, and ceramic.

12. The light emitter device component according to claim 9, wherein the coating comprises reflective particles contained therein.

13. The light emitter device component according to claim 11, wherein the reflective particles are selected from the group consisting of alumina, titanium dioxide, and zirconia.

14. The light emitter device component according to claim 9, wherein the coating has been modified by lapping, polishing, and/or another mechanical modification.

15. The light emitter device component according to claim 1, wherein the body comprises a bottom surface opposing the top surface, at least a portion of the bottom surface having a reduced porosity compared to an as-fired ceramic body.

16. The light emitter device according to claim 1, wherein the one or more electrical components are spaced from the body by one or more non-metallic layers.

18. The method of claim 16, wherein the body comprises a ceramic body.

21. The method of claim 16, wherein modifying at least a portion of a top surface comprises modifying the portion of the top surface to have a reduced porosity, wherein a remainder of the top surface has an unmodified porosity.

22. The method of claim 21, wherein modifying at least a portion of a top surface comprises modifying the portion of the top surface to have a porosity that is approximately equal to or less than approximately half of a porosity of the remainder of the top surface.

23. The method of claim 16, comprising modifying substantially all of the top surface of the body to have a reduced porosity compared to an as-fired ceramic body.

24. The method of claim 16, wherein modifying at least a portion of a top surface comprises modifying the portion of the top surface to have an open porosity of between approximately 0% and approximately 15%.

25. The method of claim 16, wherein modifying at least a portion of a top surface comprises one of lapping, polishing, or otherwise mechanically modifying the portion of the top surface.

26. The method of claim 16, wherein modifying at least a portion of a top surface comprises applying a coating to the top surface.

27. The method of claim 24, wherein applying a coating comprises applying a material selected from the group consisting of silicone, epoxy, and ceramic.

28. The method of claim 24, wherein applying a coating comprises applying a material comprising reflective particles contained therein.

29. The method of claim 26, wherein the reflective particles are selected from the group consisting of alumina, titanium dioxide, and zirconia.

30. The method of claim 24, comprising modifying the coating by lapping, polishing, and/or otherwise mechanically modifying the coating.

31. The method of claim 16, comprising modifying at least a portion of a bottom surface opposing the top surface of the body to have a reduced porosity compared to an as-fired ceramic body.

32. The method of claim 16, wherein the one or more electrical components are spaced from the body by the one or more non-metallic layers.

17. A method of forming a light emitter device component having increased brightness, the method comprising:

modifying at least a portion of a top surface of a body to have a reduced porosity compared to an as-fired ceramic body;

mounting one or more light emitter devices on the portion of the top surface that is modified;

providing one or more non-metallic layers on the top surface of the body; and

mounting one or more electrical components to the one or more non-metallic layers.

19. The method of claim 17, wherein the ceramic body comprises a thick-film ceramic substrate.

20. The method of claim 17, wherein the ceramic body comprises a thin-film ceramic substrate.