Microwave Module

• US 20130215576A1
• Filed: 04/11/2013
• Published: 08/22/2013
• Est. Priority Date: 05/17/2011
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Bergstedt, Leif, Wennberg, Goran, Hammar, Peter, Madeberg, Bengt
• Granted Patent: US 9,301,426 B2
• Time in Patent Office: Days
• US Class Current: 361/715
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 9/0056 specially adapted for microwave applications

Abstract

The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board.

Claims

1. A microwave module comprising:

a printed circuit board (PCB);

a first housing part;

a second housing part; and

a diplexer,

wherein the first housing part and the second housing part are adapted to act as a shielding cover, and

wherein the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the PCB.

2. The microwave module according to claim 1, wherein the PCB is positioned between the first housing part and the second housing part, wherein the PCB comprises a microwave side with a large plated area facing the second housing part, wherein the second housing part comprises a filter geometry facing the PCB, and wherein the diplexer is made out of the filter geometry and the plated area.

3. The microwave module according to claim 2, wherein the plated area is adapted to function as a metal cover towards the filter geometry of the second housing part.

4. The microwave module according to claim 1, wherein the first housing part functions as a mechanical fix point adapted to be fastened to an antenna.

5. The microwave module according to claim 4, wherein the first housing part comprises a wave guide adapted to lead a microwave signal in and out of the module.

6. The microwave module according to claim 4, wherein the first housing part comprises two backshort cavities.

7. The microwave module according to claim 4, wherein an outside of the first housing part comprises cooling flanges in a 45°

direction, and wherein the module is adapted to be fastened to the antenna such that the cooling flanges are protected from the sun by the antenna when the module is fastened to the antenna.

8. The microwave module according to claim 5, wherein the PCB has a plated wave guide hole adapted to feed the signal in and out from the antenna.

9. The microwave module according to claim 8, wherein the plated area comprises at least two wave guide holes.

10. The microwave module according to claim 9, wherein the PCB comprises a Teflon layer, FR4 layers, and the plated area, and wherein the wave guide hole is made in the FR4 layers and not in the Teflon layer.

11. The microwave module according to claim 10, wherein the Teflon layer comprises an antenna probe in a middle of the wave guide hole.

12. The microwave module according to claim 8, wherein via-holes are positioned around the wave guide holes.

13. The microwave module according to claim 1, wherein a side facing away from the PCB of the second housing part has threaded holes for tuning screws into the filter.

14. The microwave module according to claim 13, wherein the side facing away from the PCB of the second housing part comprises an area for connectors, wherein connectors are mounted on the area for connectors, wherein pins from the connectors are guided through the second housing part to the PCB, and wherein the PCB has receptors adapted to a mechanical contact and an electrical contact with the pins.

15. The microwave module according to claim 14, wherein the area for connectors is mechanically protected.

16. The microwave module according to claim 1, wherein a loopback function is integrated on the PCB.

17. The microwave module according to claim 1, wherein the diplexer function is designed according to H-plane technologies.

18. The microwave module according to claim 1, wherein the diplexer function is designed according to E-plane technologies.

19. The microwave module according to claim 1, wherein isolators are integrated on the PCB such that the isolators are housed by the first housing part.

20. The microwave module according to claim 1, wherein the module is weather protected.

21. The microwave module according to claim 20, wherein at least one O-ring is positioned between the first housing part and the second housing part.

22. The microwave module according to claim 21, wherein the second housing part comprises a slot around an edge of the side facing the PCB, and wherein a first O-ring is positioned in the slot adapted to function as a sheared gasket solution.

23. The microwave module according to claim 1, wherein a sealed protection plate is adapted to cover the part of the side facing away from the PCB of the second housing part, and wherein the sealed protection plate comprises threaded holes for tuning screws into the filter and holes for mounting screws for fixating the first housing part and the second housing part to each other.

24. The microwave module according to claim 23, wherein the sealed protection plate is sealed to the second housing part by an O-ring or another sealing gasket solution.