PACKAGE FOR LIGHT EMITTING DEVICE AND METHOD FOR PACKAGING THE SAME

• US 20130229800A1
• Filed: 03/28/2013
• Published: 09/05/2013
• Est. Priority Date: 12/17/2004
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: PARK, Jun Seok
• Granted Patent: US 9,671,099 B2
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: F21K 9/69 Details of refractors forming part of the light source
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 5/045 the lens having discontinuous faces, e.g. Fresnel lenses
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 5/1876 Diffractive Fresnel lenses; Zone plates; Kinoforms G02B5/1842, G02B5/1847 take precedence; optical systems having diffractive correction means G02B27/0037; Fresnel lenses operating by refraction G02B3/08
• CPC Class Codes: G02B 5/1885 Arranged as a periodic array
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer

Abstract

There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.

Claims

1. A light emitting apparatus comprising:

a circuit board;

a light emitting device module on the circuit board, wherein the light emitting device module is electrically connected to the circuit board, and the light emitting device module comprises at least one light emitting device chip;

a lens unit including a lens and a support between the lens and the circuit board; and

wherein the support is in contact with the circuit board, and

wherein a bottom surface of the at least one light emitting device chip is higher than a bottom surface of the support.

2. The light emitting apparatus according to claim 1, wherein the lens is provided at an upper side of the light emitting device module, wherein the lens is spaced from the light emitting device module.

3. The light emitting apparatus according to claim 1, further comprising a barrier disposed on a top surface of the circuit board and around the light emitting device module.

4. The light emitting apparatus according to claim 3, wherein the barrier is in contact with an outer side surface of the support and supports the lens unit.

5. The light emitting apparatus according to claim 3, wherein a portion of the support is exposed at an upper side of the barrier.

6. The light emitting apparatus according to claim 3, wherein the barrier includes a ring shape.

7. The light emitting apparatus according to claim 3, wherein the barrier has a substantial uniform thickness.

8. The light emitting apparatus according to claim 1, wherein the light emitting device module is completely contained within the lens unit.

9. The light emitting apparatus according to claim 1, wherein the support is in contact with a top-most surface of the circuit board.

10. The light source according to claim 1, wherein an outside surface of the support is disposed on an inside area of an outside surface of the lens.

11. A light emitting apparatus comprising:

a circuit board;

a light emitting device on the circuit board, the light emitting device electrically connected to the circuit board;

a lens unit including a lens and a support between the lens and the circuit board; and

a barrier disposed on a top surface of the circuit board and around the light emitting device.

12. The light source according to claim 11, wherein the barrier is in contact with an outer side surface of the support and supports the lens unit.

13. The light emitting apparatus according to claim 11, wherein a portion of the support is exposed at an upper side of the barrier.

14. The light emitting apparatus according to claim 11, wherein the barrier includes a ring shape.

15. The light emitting apparatus according to claim 11, wherein the barrier has a substantial uniform thickness.

16. The light emitting apparatus according to claim 11, wherein the light emitting device module comprises at least one light emitting device chip, and

wherein a bottom surface of the at least one light emitting device chip is higher than a bottom surface of the lens unit.

17. The light emitting apparatus according to claim 11, wherein the light emitting device module is completely contained within the lens unit.

18. The light emitting apparatus according to claim 11, wherein the support is in contact with a top-most surface of the circuit board.

19. The light source according to claim 11, wherein an outside surface of the support is disposed on an inside area of an outside surface of the lens.

20. The light source according to claim 11, wherein the lens has at least one of a concave shape, a convex shape, a trapezoidal shape, an inverted pyramid shape, or a Fresnel lens.

21. The light emitting apparatus according to claim 11, wherein the lens unit includes a flat surface on a peripheral region of an upper surface.