INFORMATION CARRYING CARD COMPRISING A CROSS-LINKED POLYMER COMPOSITION, AND METHOD OF MAKING THE SAME

• US 20130255078A1
• Filed: 10/11/2012
• Published: 10/03/2013
• Est. Priority Date: 04/03/2012
• Status: Active Grant

• Current Assignee: X-Card Holdings LLC
• Original Assignee: X-Card Holdings LLC
• Inventors: Cox, Mark A.
• Granted Patent: US 9,183,486 B2
• Time in Patent Office: Days
• US Class Current: 29/830
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2255/26 Polymeric coating
• CPC Class Codes: B32B 2264/02 Synthetic macromolecular particles
• CPC Class Codes: B32B 2307/748 Releasability
• CPC Class Codes: B32B 2307/75 Printability
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/20 using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 27/205 the fillers creating voids or cavities, e.g. by stretching
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 3/18 characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side B32B5/02 takes precedence
• CPC Class Codes: B32B 3/26 characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids foam layer B32B5/18; layer of synthetic resin characterised by fillers that create voids or cavities B32B27/205; characterised by an apertured layer
• CPC Class Codes: B32B 3/30 characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 37/06 characterised by the heating method
• CPC Class Codes: B32B 37/08 characterised by the cooling method
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: C08L 2203/206 use in coating or encapsulating of electronic parts
• CPC Class Codes: C08L 27/06 Homopolymers or copolymers of vinyl chloride
• CPC Class Codes: C08L 33/14 : of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
• CPC Class Codes: C08L 63/10 : Epoxy resins modified by unsaturated compounds
• CPC Class Codes: C08L 75/04 : Polyurethanes
• CPC Class Codes: C08L 75/06 : from polyesters
• CPC Class Codes: C08L 75/14 : Polyurethanes having carbon-to-carbon unsaturated bonds
• CPC Class Codes: C08L 75/16 : having terminal carbon-to-carbon unsaturated bonds
• CPC Class Codes: G06K 19/07722 : the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07745 : Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0313 : Organic insulating material
• CPC Class Codes: H05K 1/0353 : consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/09036 : Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/10037 : Printed or non-printed battery
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 428/24612 : Composite web or sheet
• CPC Class Codes: Y10T 428/31511 : Of epoxy ether
• CPC Class Codes: Y10T 428/31529 : Next to metal
• CPC Class Codes: Y10T 428/31598 : Next to silicon-containing [silicone, cement, etc.] layer
• CPC Class Codes: Y10T 428/31605 : Next to free metal
• CPC Class Codes: Y10T 428/31663 : As siloxane, silicone or silane
• CPC Class Codes: Y10T 428/31667 : Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
• CPC Class Codes: Y10T 428/31692 : Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31699 : Ester, halide or nitrile of addition polymer

Abstract

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

Claims

1. A method for forming a core layer of an information carrying card, comprising:

forming a first thermoplastic layer having at least one cavity, the first thermoplastic layer comprising at least one thermoplastic material;

disposing an inlay layer of printed circuit board (PCB) partially or fully into the at least one cavity, the inlay layer of PCB comprising at least one integrated circuit, at least one wire and a supporting film; and

dispensing a crosslinkable polymer composition over the inlay layer in the at least one cavity, the crosslinkable polymer composition comprising;

a curable base polymer resin in a liquid or paste form, the base polymer resin selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy; and

a particulate thermoplastic filler.

2. The method for forming a core layer of an information carrying card of claim 1 further comprising:

providing a first release film;

placing a second release film above the first release film;

and placing the first thermoplastic layer having at least one cavity above the second release film before disposing the inlay layer in the at least one cavity.

3. The method for forming a core layer of an information carrying card of claim 2 further comprising:

placing a third release film over the inlay layer after dispensing the crosslinkable polymer composition in the at least one cavity; and

placing a fourth release film above the third release film and forming a sandwich structure.

4. The method for forming a core layer of an information carrying card of claim 3 wherein the first and the fourth release films are the same, and the second and the third release films are the same.

5. The method for forming a core layer of an information carrying card of claim 3 wherein the second and the third release films are a breathable release film.

6. The method for forming a core layer of an information carrying card of claim 3 further comprising:

pressing the sandwich structure under a pressure.

7. The method for forming a core layer of an information carrying card of claim 6 wherein the pressure is less than 2 MPa.

8. The method for forming a core layer of an information carrying card of claim 6 further comprising:

heating the sandwich structure at a raised temperature under the pressure;

cooling the sandwich structure; and

peeling off the first, second, third and fourth release films.

9. The method for forming a core layer of an information carrying card of claim 6 wherein the raised temperature is less than 150°

C.

10. The method for forming a core layer of an information carrying card of claim 1 further comprising:

forming a plurality of holes by cutting a plurality of portions of the supporting film without damages to any of the at least one wire and the at least one integrated circuit on the inlay layer, before disposing the inlay layer of PCB into the at least one cavity on the first thermoplastic layer.

11. The method for forming a core layer of an information carrying card of claim 10 further comprising:

fixing the inlay layer onto the first thermoplastic layer by applying an instant adhesive in the plurality of holes of the inlay layer, before dispensing the crosslinkable polymer composition over the inlay layer.

12. The method for forming a core layer of an information carrying card of claim 11 wherein the instant adhesive comprises cyanoacrylate.

13. The method for forming a core layer of an information carrying card of claim 1 wherein forming the first thermoplastic layer having at least one cavity comprises:

die-cutting one or more thermoplastic films; and

laminating the one or more thermoplastic films under a heating condition.

14. The method for forming a core layer of an information carrying card of claim 1 wherein the size of the at least one cavity on the first thermoplastic layer is larger than the size of the inlay layer of PCB.

15. The method for forming a core layer of an information carrying card of claim 1 wherein the size of the at least one cavity on the first thermoplastic layer is substantially the same as the size of the inlay layer of PCB.

16. The method for forming a core layer of an information carrying card of claim 1 wherein the size of the at least one cavity on the first thermoplastic layer is substantially the same as the size of a portion of the inlay layer of PCB.

17. The method for forming a core layer of an information carrying card of claim 3 wherein the first thermoplastic layer having at least one cavity comprises a thermoplastic material selected from polyvinyl chloride, copolymer of vinyl chloride, polyolefin, polycarbonate, polyester, polyamide, and acrylonitrile butadiene styrene copolymer (ABS).

18. The method for forming a core layer of an information carrying card of claim 3 wherein the curable base polymer in the crosslinkable polymer composition is urethane acrylate.

19. The method for forming a core layer of an information carrying card of claim 3 wherein the particulate thermoplastic filler in the crosslinkable polymer composition comprises PVC or a copolymer of vinyl chloride and at least another monomer.

20. The method for forming a core layer of an information carrying card of claim 19 wherein the particulate thermoplastic filler in the crosslinkable polymer composition comprises a copolymer of vinyl chloride and at least another monomer selected from the group consisting of vinyl ester, vinyl acetate and vinyl ether.

21. The method for forming a core layer of an information carrying card of claim 20 wherein the particulate thermoplastic filler in the crosslinkable polymer composition is a PVC modified with a copolymer of vinyl chloride and at least another monomer selected from the group consisting of vinyl ester, vinyl acetate and vinyl ether.

22. The method for forming a core layer of an information carrying card of claim 6 further comprising curing the crosslinkable polymer under a UV light.

23. A method for fabricating an information carrying card, comprising forming a core layer of the information carrying card according to claim 1.

24. A method for fabricating an information carrying card of claim 23 further comprising laminating a printable thermoplastic film on each side of the core layer of the information carrying card.

25. A method for fabricating an information carrying card of claim 24 further comprising laminating a transparent thermoplastic film on the printable thermoplastic film each side of the core layer of the information carrying card.